Heat Conduction Composition with Low Surface Area Particles
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Solution Overview
Problem
Existing thermal conduction compositions for electronic devices face challenges in achieving high thermal conductivity while maintaining electrical insulation and mechanical cohesion, often requiring high fractions of thermally conducting auxiliaries which compromise bond strength and are difficult to meter and apply accurately.
Innovation Solution
A thermal conduction composition with thermally conducting auxiliaries having a mass-based specific surface area of 1.3 m2/g or less, composed of particles with an irregular surface and average diameters of at least 1 μm, such as aluminum oxide and boron nitride, which enhances thermal conductivity and cohesion without reducing bond strength, allowing for efficient heat transfer and mechanical robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If high fractions of thermally conducting auxiliaries are used to achieve high thermal conductivity, then thermal conductivity is improved, but bond strength deteriorates
Solution Approach 1:
The patent changes the particle size parameter of the thermally conducting auxiliaries to micrometer range (at least 1 μm), which reduces the specific surface area and allows achieving high thermal conductivity with lower auxiliary fractions, thereby maintaining bond strength
Solution Approach 2:
The patent creates a composite material system combining polymer matrix with specifically sized thermally conducting auxiliaries (aluminum oxide, boron nitride) to achieve both high thermal conductivity and mechanical strength through optimized composition
2Temperature
If conventional small particle auxiliaries are used, then thermal conductivity is improved, but processing accuracy deteriorates due to difficulty in metering and application
Solution Approach 1:
The patent changes the particle size parameter to micrometer range (at least 1 μm), which improves flowability and handling characteristics, enabling accurate metering and application while maintaining high thermal conductivity
Solution Approach 2:
The patent transitions from nanometer-scale particles to micrometer-scale particles, representing a dimensional change that fundamentally improves processing characteristics while maintaining thermal performance
3Temperature
If high fractions of thermally conducting auxiliaries are used, then thermal conductivity is improved, but mechanical cohesion deteriorates
Solution Approach 1:
The patent changes the particle size parameter to micrometer range, which reduces the total surface area requiring polymer binding, thereby maintaining mechanical cohesion even with thermally conducting auxiliary fractions of 60-90 wt%
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high thermal conductivity and durable thermal contact between heat sources and sinks, preventing overheating and ensuring reliable heat transport within electronic devices, with improved processing qualities and reduced need for additional fixing means.
Implementation Method 1
One possibility for heat transfer is thermal conduction... The invention relates to a thermal conduction composition comprising at least one polymer and a thermally conducting auxiliary... for heat transport within electronic devices
Data Source
AI summary
A heat conduction composition is proposed, comprising at least one polymer and a heat-conducting auxiliary material that has an especially high heat conductivity and at the same time has a high mechanical strength. To this end, the heat-conducting auxiliary material comprises particles that in turn are made up of primary particles and that have a mass-specific surface area of 1.3 m2/g or less. Also described are a heat-conducting surface element manufactured from said heat conduction composition as well as application possibilities thereof.