Heat Conduction Pattern for Transient Temperature Protection
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Solution Overview
Problem
In low-voltage integrated circuits (LVICs) used in inverter modules, there is an insufficient temperature protection during transient operations like motor lock or short-circuit operations due to temperature deviations between the IGBT chip and the temperature protection circuit.
Innovation Solution
A heat conduction pattern is introduced to connect the output pad of the switching device with the temperature protection circuit, allowing for efficient heat transfer and accurate temperature sensing, ensuring the temperature protection circuit can detect abrupt temperature increases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat is conducted through metal frame and sealing molding resin, then temperature protection circuit can detect temperature in normal operation, but temperature deviation occurs during transient operation causing insufficient temperature protection
Solution Approach 1:
The heat conduction path is segmented into two distinct paths: one for normal operation (metal frame and sealing molding resin) and another for transient operation (heat conduction pattern through substrate). This segmentation allows each path to be optimized for its specific operational condition, resolving the contradiction between reliable temperature protection in normal operation and accurate temperature detection during transient operation.
Solution Approach 2:
The heat conduction pattern acts as an intermediary element that directly connects the switching device to the temperature protection circuit through the substrate. This intermediary provides a dedicated thermal pathway that responds quickly to transient temperature changes, enabling accurate temperature detection during transient operations without interfering with the normal heat conduction path.
2Measurement precision
If heat conduction pattern is added to connect output pad with temperature protection circuit, then temperature detection accuracy improves during transient operation, but device complexity increases
Solution Approach 1:
The heat conduction pattern is merged with the existing substrate structure, utilizing the substrate as the heat conduction medium. This merging approach integrates the temperature protection function into the existing device architecture without requiring separate complex structures, thereby improving temperature detection accuracy while minimizing increases in device complexity.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, electrical insulation, and heat conduction. By utilizing the substrate's inherent thermal conductivity for the heat conduction pattern, the invention achieves accurate temperature detection during transient operation without adding dedicated heat conduction components, thus avoiding increased device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides sufficient temperature protection, preventing breakdowns during steep temperature increases in transient operations and simplifies temperature protection settings in various applications, improving detection accuracy at a low cost.
Implementation Method 1
a heat conduction pattern connected with the output pad, extending from the output pad toward the temperature protection circuit, and conducting heat generated at the switching device to the temperature protection circuit
Data Source
AI summary
A semiconductor module includes: a switching device including a gate pad; an output unit including an output pad connected with the gate pad of the switching device through a wire and outputting a drive signal from the output pad to the switching device; a temperature protection circuit detecting temperature and performing protection operation; and a heat conduction pattern connected with the output pad, extending from the output pad toward the temperature protection circuit, and conducting heat generated at the switching device to the temperature protection circuit.