Heat Conduction Structure for Handheld Device Thermal Management

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Solution Overview

Problem

Existing heat dissipation methods for mobile phones rely on undiversified heat transfer paths with high resistance, leading to poor heat dissipation efficiency and limiting performance improvements in handheld electronic devices.

Innovation Solution

A handheld electronic device incorporating a heat conduction structure that extends from the main board's front surface to the back surface, with one end embedded in the frame and the other end in contact with the back cover, enhancing heat transfer efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional contact-based heat dissipation methods are used with multiple heat dissipation elements, then the device structure is established, but the heat transfer resistance is high and heat dissipation efficiency is poor

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidheat dissipation path complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The heat dissipation system is segmented into multiple independent heat conduction structures, each extending from different locations of the main board to the back cover. This segmentation creates multiple parallel heat transfer paths, reducing overall thermal resistance and improving heat dissipation efficiency without requiring a single complex heat dissipation mechanism

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat conduction structures extend in the thickness direction of the main board, from the front surface where heat sources are located to the back surface where they contact the back cover. This dimensional approach creates direct heat transfer paths through the device thickness, bypassing traditional lateral heat transfer routes and reducing thermal resistance

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Loss of energy

If multiple heat dissipation elements are used to transfer heat to the metal frame, then heat transfer paths are established, but the heat transfer resistance is high

Engineering Contradiction:

Improveheat transfer resistanceVSAvoidheat dissipation performance

Core Design Contradiction:

Loss of energyVSProductivity

Solution Approach 1:

The heat conduction structures are integrated directly with both the main board and the back cover, merging these components into a unified heat dissipation system. This integration eliminates intermediate heat transfer interfaces and reduces thermal resistance by creating direct thermal coupling between the heat sources on the main board and the back cover

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat conduction structures serve as thermal intermediaries, bridging the heat sources on the main board and the back cover. These structures are specifically designed with high thermal conductivity materials and optimized geometries to efficiently transfer heat from the front surface to the back surface, reducing thermal resistance along the heat transfer path

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If conventional heat dissipation methods are used, then the device structure is maintained, but the heat dissipation efficiency prevents performance improvement

Engineering Contradiction:

Improvedevice performanceVSAvoidheat dissipation efficiency

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

The thermal conductivity parameter of the heat conduction structures is optimized by selecting materials with high thermal conductivity. Additionally, the cross-sectional area and length of the heat conduction paths are adjusted to maximize heat transfer efficiency, allowing the device to achieve better heat dissipation performance without compromising structural integrity

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed heat conduction structure significantly improves heat dissipation efficiency by providing multiple heat transfer paths, effectively alleviating the limitations of conventional heat dissipation methods and enhancing device performance.

Implementation Method 1

The heat conduction structure extends from the front surface to the back surface, and includes a first end and a second end opposite to each other. The first end is arranged at the heat source, and the second end extends to the back cover.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12302531B2Handheld electronic device

Publication Date: 2025.05.13 ASUSTEK COMPUTER INC

AI summary

A handheld electronic device is provided. The handheld electronic device includes a screen, a back cover, a frame, a main board, and a heat conduction structure. The frame is arranged between the screen and the back cover. The frame and the back cover define a space. The main board is arranged in the space, and includes a front surface and a back surface. The front surface faces the screen and includes a heat source. The heat conduction structure extends from the front surface to the back surface, and includes a first end and a second end opposite to each other. The first end is arranged at the heat source, and the second end extends to the back cover.