Heat-Conductive Sheet With Interface Filler Gradient

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Solution Overview

Problem

Heat-conducting sheets with exposed carbon fibers in laminated structures face issues such as poor adhesion between layers, bubble formation, and inadequate electrical insulation, limiting their application in electronic devices, while existing solutions with electrical insulation properties lack sufficient thermal conduction.

Innovation Solution

A heat-conducting sheet with a laminated structure featuring a lower anisotropic filler filling ratio in the interface between layers, combined with a higher non-anisotropic filler filling ratio, ensuring good adhesion and thermal conduction while maintaining electrical insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If heat-conducting members with exposed carbon fibers are laminated to improve thermal conduction properties, then thermal conduction in the thickness direction is enhanced, but adhesion between layers deteriorates and bubbles form

Engineering Contradiction:
Improvethermal conduction propertiesVSAvoidadhesion between layers
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent applies local quality by creating a skin layer with different properties from the bulk material. The skin layer has a lower filling ratio of anisotropic filler (carbon fibers) compared to the inner heat-conducting layers, which improves adhesion between laminated layers while the inner layers maintain high thermal conduction. This local differentiation resolves the contradiction between thermal conduction and adhesion.

Inventive Principle:
Principle #3Local quality

2Reliability

If carbon fibers are oriented in the thickness direction to enhance thermal conduction, then thermal conduction properties improve, but electrical insulation properties deteriorate

Engineering Contradiction:
Improvethermal conduction propertiesVSAvoidelectrical insulation properties
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent uses local quality by creating a skin layer with reduced anisotropic filler content at the surfaces. This skin layer provides electrical insulation while the inner layers with high anisotropic filler content provide thermal conduction. The differentiated structure allows simultaneous achievement of both thermal conduction and electrical insulation properties.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs composite materials by combining layers with different filler ratios and potentially different filler types. The skin layer may contain different filler materials or concentrations compared to the inner layers, creating a composite structure that achieves both thermal conduction and electrical insulation functions.

Inventive Principle:
Principle #40Composite materials

3Reliability

If a laminated structure is formed with heat-conducting layers to improve thermal conduction, then thermal conduction properties are enhanced, but manufacturing complexity increases due to adhesion issues

Engineering Contradiction:
Improvethermal conduction propertiesVSAvoidlaminating process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent simplifies manufacturing by creating a skin layer with lower anisotropic filler content that provides better adhesion properties. This local modification at the bonding surfaces facilitates the laminating process and reduces manufacturing complexity while maintaining the thermal conduction benefits of the laminated structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves effective adhesion and thermal conduction in the thickness direction while securing electrical insulation, enhancing the sheet's versatility for electronic devices.

Implementation Method 1

a heat-conducting sheet used by arranging between a heat-generating element and a heat-dissipating element... to increase the efficiency of heat transfer... a filler having thermal conduction properties

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a polymer matrix having high flexibility, such as rubber or a gel

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS11610829B2Heat-conductive sheet
Publication Date: 2023.03.21 SEKISUI POLYMATECH CO LTD
  • US11610829B2 patent drawing
  • US11610829B2 patent drawing
  • US11610829B2 patent drawing

AI summary

A heat-conducting sheet comprising a first heat-conducting layer, a second heat-conducting layer, an interface, a polymer matrix, an anisotropic filler and a non-anisotropic filler, wherein: the first and second heat-conducting layers each comprise the polymer matrix, the anisotropic filler and the non-anisotropic filler, the anisotropic filler oriented in a thickness direction, the first and second heat-conducting layers are laminated via the interface, the interface comprises the polymer matrix and the non-anisotropic filler, a filling ratio of the anisotropic filler in the interface is lower than that in the first and second heat-conducting layers, and a filling ratio of the non-anisotropic filler in the interface is higher than that in the first and second heat-conducting layers; and a method of producing the heat-conducting sheet.