Heat Conductor Protuberance Socket Assembly Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic component packages, particularly those with integrated circuits, face challenges in effectively dissipating heat due to the thermal insulating properties of resin, which can lead to inadequate heat conduction through the substrate, especially in complex system-on-chip ICs.
Innovation Solution
A heat conductor with protuberances that fit into sockets on the support, ensuring accurate placement and improved heat conduction, is used. This arrangement includes conductive sticking material applied to the exit points of the sockets to secure the heat conductor in position during assembly, reducing the risk of lateral movement and tilting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat conductor is placed above the IC to improve heat conduction, then heat dissipation is improved, but the heat conductor risks being moved during the assembly process
Solution Approach 1:
The support is segmented with multiple sockets distributed across its surface, each capable of receiving a protuberance from the heat conductor. This segmentation allows for multiple attachment points that collectively stabilize the heat conductor's position during assembly, preventing lateral movement and tilting while maintaining thermal contact with the IC.
Solution Approach 2:
The solution transitions from a two-dimensional planar attachment to a three-dimensional mechanical interlocking system. Protuberances extending from the heat conductor vertically into sockets on the support create a depth dimension that mechanically constrains the heat conductor's position, preventing movement in multiple directions simultaneously while allowing thermal conduction.
2Reliability
If the heat conductor is secured firmly to the support, then position stability is improved, but the assembly process becomes more complex
Solution Approach 1:
The heat conductor's own structure provides its own positioning and securing mechanism through the protuberances that naturally extend from its body. These protuberances self-align with and insert into the sockets on the support during assembly, creating a self-securing system that stabilizes the heat conductor without requiring additional fasteners, adhesives, or complex assembly steps.
Solution Approach 2:
The sockets on the support act as intermediary elements that mediate between the heat conductor and the support structure. These sockets receive and accommodate the protuberances, providing a standardized interface that simplifies the assembly process while ensuring reliable mechanical and thermal connection. The intermediary sockets absorb positioning tolerances and facilitate easy assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation from integrated circuits by maintaining precise positioning of the heat conductor, reducing the risk of weakened joints and short circuits, while allowing for improved thermal conduction and visual acceptability of the package.
Implementation Method 1
the integrated circuit (IC), or other electronic component, produces heat that must be removed from the package. In certain cases, for example, with complex system-on-chip IC's, the amount of heat produced is such that conduction through the resin and substrate are not enough.
Implementation Method 2
there is conductive sticking material deposited on the exit point
Implementation Method 3
there is a solder ball attached to the exit point
Data Source
AI summary
An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.