Heat Cost Allocator Sensor PCB Thermal Decoupling
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Solution Overview
Problem
Existing heat cost allocators face challenges in accurately measuring radiator heat output due to inadequate thermal decoupling of temperature sensors, leading to inefficient heat transfer and increased manufacturing costs, particularly in low-temperature heating systems.
Innovation Solution
A heat cost allocator design featuring a radiator temperature sensor on a sensor circuit board mechanically and electrically connected to a main circuit board via spring elements, optimizing thermal coupling with the radiator while maintaining thermal decoupling of the room air temperature sensor, using a low-cost NTC resistor in SMD design and a thermally conductive foil for improved heat transfer and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If temperature sensors are arranged on a printed circuit board inside a housing, then the device structure is simplified and manufacturing cost is reduced, but thermal decoupling between the radiator temperature sensor and room air temperature sensor becomes inadequate, leading to measurement errors
Solution Approach 1:
The device is divided into two separate printed circuit boards: a first PCB carrying the radiator temperature sensor and a second PCB carrying the room air temperature sensor. This segmentation physically separates the two sensors, enabling independent thermal management for each sensor and preventing cross-thermal interference while maintaining simple device structure.
Solution Approach 2:
A thermally insulating barrier is introduced between the first and second printed circuit boards to act as a thermal mediator. This barrier selectively blocks heat transfer from the radiator temperature sensor to the room air temperature sensor, ensuring accurate temperature measurements for both sensors without requiring complex thermal isolation mechanisms.
2Measurement precision
If a rotatable or pivotable printed circuit board is used to achieve thermal decoupling, then thermal isolation between sensors is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The thermal decoupling function is extracted from the mechanical configuration of the printed circuit board and implemented through a dedicated thermally insulating barrier. This allows both PCBs to maintain fixed, simple positions while achieving effective thermal isolation, eliminating the need for rotatable or pivotable board designs.
Solution Approach 2:
A simple, inexpensive thermally insulating barrier is used instead of complex mechanical adjustment mechanisms. This barrier provides sufficient thermal decoupling without requiring precise positioning or adjustment, reducing manufacturing complexity and assembly difficulty.
3Temperature
If an elastic printed circuit board is used to press the temperature sensor against the radiator, then thermal contact is optimized, but the structural stability and manufacturing precision of the device decrease
Solution Approach 1:
The functions of thermal contact optimization and structural stability are merged into a single rigid printed circuit board design. The first PCB is positioned to directly contact the radiator surface, and its rigidity ensures both stable thermal contact and precise positioning, eliminating the need for elastic materials.
Solution Approach 2:
The thermal contact between the first printed circuit board and the radiator is optimized during the design and assembly stage through precise positioning and mechanical fixation. This preliminary optimization ensures consistent thermal contact without requiring elastic deformation during operation, maintaining manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise measurement of radiator and room air temperatures, reducing manufacturing costs and size, while being adaptable to various applications with different radiator profiles, suitable for all areas, including low-temperature heating systems.
Implementation Method 1
By pressing the sensor circuit board against the rear part of the housing, thermal coupling of the radiator temperature sensor to the rear part of the housing, by means of which the heat cost allocator is attached to the radiator, is optimized.
Implementation Method 2
The radiator temperature sensor is arranged on a sensor circuit board, which is mechanically and electrically connected to the main circuit board via at least two spring elements and is pressed against the rear part of the housing of the heat cost allocator by means of these spring elements.
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3~4A
AI summary
The distributor (1) has a housing (2) in which a heater temperature sensor (3) i.e. negative temperature co-efficient (NTC) thermistor, an ambient air temperature sensor (4) and an evaluation unit are arranged. The evaluation unit is arranged on a prime conductor plate (6), and is electrically connected with the sensors. The heater temperature sensor is arranged on a sensor conductor plate (9) that is mechanically and electrically connected with the prime conductor plate by two spring elements (10). The sensor conductor plate is pressed against a housing rear part (2.2) by the spring elements.