Heat-Curable Resin Composition for Low Dielectric Applications
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Solution Overview
Problem
Existing heat-curable resin compositions for printed-wiring boards and semiconductor encapsulation materials face challenges with high melt viscosity, brittleness, and adhesion failure under high-temperature environments due to high relative permittivity and dielectric tangent, limiting their use in high-frequency applications.
Innovation Solution
A heat-curable resin composition comprising a citraconimide compound, an epoxy resin, an epoxy resin curing agent, and a curing accelerator, which provides low viscosity, low relative permittivity, low dielectric tangent, high adhesiveness, and high heat resistance, suitable for adhesive agents and semiconductor encapsulation materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat-curable resins such as modified polyphenyleneether resin, maleimide resin, or epoxy resin are used, then low relative permittivity and low dielectric tangent are achieved, but high melt viscosity and brittleness occur
Solution Approach 1:
The invention uses a composite resin system combining polyphenylene ether (PPE) or poly(4,6-dimethyl-1,3-sylene) with a maleimide-modified component. This composite approach allows the base resin to provide low dielectric properties while the maleimide modification reduces melt viscosity and brittleness, achieving both low relative permittivity (2.3-3.0) and improved processability
Solution Approach 2:
The invention modifies the chemical structure by introducing maleimide groups onto the resin backbone, changing the physical and chemical parameters of the base resin. This modification reduces the glass transition temperature and melt viscosity while maintaining the low dielectric properties of the original resin system
2Strength
If conventional heat-curable resins are used, then adhesion to base materials is achieved, but adhesion failure occurs under high-temperature environment
Solution Approach 1:
The maleimide modification changes the thermal and adhesive parameters of the resin system. The modified resin maintains strong adhesion to base materials while exhibiting enhanced heat resistance, preventing adhesion failure at elevated temperatures through improved thermal stability of the adhesive bond
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves superior adhesiveness and heat resistance while maintaining low dielectric properties, making it suitable for high-frequency applications and environments with improved handling properties.
Implementation Method 1
a curing accelerator... the cured product of the composition has a high adhesiveness and a high heat resistance while exhibiting a low relative permittivity and a low dielectric tangent
Data Source
AI summary
Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains:(A) a citraconimide compound;(B) an epoxy resin;(C) an epoxy resin curing agent; and(D) a curing accelerator.