Heat-Curable Silicone Composition for LED Sealing
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Solution Overview
Problem
Epoxy resin-based sealing materials for light emitting diode (LED) elements face issues such as yellowing due to UV exposure and increased cracking from heating, and curing problems due to platinum catalyst inhibitors, which are not effectively addressed by existing silicone resin uses.
Innovation Solution
A heat-curable silicone resin composition comprising an organopolysiloxane with specific structural units and an organic peroxide as a curing catalyst, which yields a transparent, heat-resistant cured product suitable for LED applications, including protection, bonding, wavelength adjustment, and lens materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin-based sealing materials are used for LED elements, then good initial sealing performance is achieved, but yellowing occurs due to UV exposure and cracking increases due to heating
Solution Approach 1:
The patent changes the chemical composition parameters by using specific organopolysiloxane structures with particular ratios of functional groups (vinyl, phenyl, hydrogen) and curing agents to achieve a cured product with superior UV resistance and heat resistance compared to conventional epoxy resins, thereby preventing yellowing and cracking while maintaining sealing performance
Solution Approach 2:
The patent creates a composite material system combining organopolysiloxane base resin with specific additives including curing agents, catalysts, and fillers to develop a silicone-based sealing composition that overcomes the limitations of pure epoxy resin, achieving both excellent initial sealing and long-term durability under UV and thermal stress
2Illumination intensity
If silicone resin is used as lens material or wavelength-altering coating, then transparency is improved, but curing problems occur due to platinum catalyst inhibitors in LED
Solution Approach 1:
The patent extracts the problematic platinum catalyst from the system and replaces it with alternative curing mechanisms using organic peroxides and other non-platinum catalysts that are not inhibited by LED components, thereby enabling complete curing of silicone resin while maintaining transparency
Solution Approach 2:
The patent changes the curing chemistry parameters by selecting specific organic peroxides and catalyst systems that operate effectively in the presence of LED materials without inhibition, achieving both complete curing and optical clarity
3Strength
If epoxy resin is used for sealing, then good adhesion is achieved, but discoloration occurs over time due to UV exposure
Solution Approach 1:
The patent changes the chemical composition by using organopolysiloxane with specific functional groups and ratios that inherently provide UV stability, preventing discoloration while maintaining adhesion properties through careful selection of base resin and additives
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides excellent transparency and discoloration resistance, addressing the limitations of epoxy resins and ensuring reliable performance in LED elements over time.
Implementation Method 1
a quantity of an organic peroxide that is effective as a curing catalyst
Implementation Method 2
upon curing, the above composition yields a transparent cured product that exhibits excellent heat resistance and discoloration resistance
Data Source
AI summary
Provided is a heat-curable silicone composition containing: (A) an organopolysiloxane having at least one structure represented by the following general formula (2) within each molecule:wherein m represents an integer of 0, 1 or 2, R1 represents a hydrogen atom, a phenyl group or a halogenated phenyl group, R2 represents a hydrogen atom or a methyl group, R3 represents an identical or different monovalent organic group having 1 to 10 carbon atoms, and R4 represents an identical or different bivalent organic group having 1 to 10 carbon atoms; and (B) a quantity of an organic peroxide that is effective as a curing catalyst. The heat-curable silicon composition yields a cured product having excellent transparency and minimal discoloration over time. Also provided is a light emitting diode element having a material composed of the cured product.