Heat-Dissipating Housing Material for Low-Signature Battery Packs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Heat-generating portable electronic devices, such as radios, pose a risk of causing discomfort or burns to users due to heat transfer and increase the heat signature of military personnel, making them more detectable by thermal imaging, while existing solutions do not effectively dissipate heat from battery housings or reduce heat signatures.
Innovation Solution
A heat-shielding or blocking, heat-dissipating, and heat signature-reducing material layer is integrated into the housing of electronic devices and battery packs, using materials like copper shielding plastic or copper impregnated polymers, which can be sandwiched between substrates to protect against external heat and reduce heat signatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If heat-generating portable electronic devices are used, then device functionality is provided, but heat transfer causes discomfort or burns to users and increases heat signature making personnel detectable
Solution Approach 1:
A heat-dissipating material layer is introduced as an intermediary between the heat-generating device and the user. This layer actively manages heat transfer by conducting heat away from the device housing, preventing it from reaching the user's body while maintaining device functionality.
Solution Approach 2:
The patent changes the thermal parameters of the device housing by applying a heat-dissipating material layer with specific thermal conductivity properties. This layer modifies the heat transfer characteristics, reducing the temperature at the user-contact surface while maintaining overall device operation.
2Productivity
If heat-generating devices are used, then device functionality is provided, but heat signature increases making personnel more prone to detection by thermal imaging
Solution Approach 1:
The heat-dissipating material layer serves as a thermal management intermediary that redistributes and conducts heat away from the device exterior surfaces. This reduces the thermal signature visible to thermal imaging systems while allowing the device to continue operating at full functionality.
3Object-affected harmful factors
If heat dissipating material is applied to device housing, then heat transfer to user is reduced, but device complexity increases
Solution Approach 1:
The patent employs a thin film or layer of heat-dissipating material applied to the device housing. This thin-layer approach provides effective thermal management without significantly increasing device complexity, weight, or bulk, as the material layer is sufficiently thin to be integrated into existing housing designs.
4Temperature
If copper shielding plastic or copper impregnated polymers are used, then heat dissipation effectiveness is improved, but manufacturing complexity increases
Solution Approach 1:
The patent utilizes composite materials such as copper shielding plastic or copper impregnated polymers that combine the high thermal conductivity of copper with the ease of fabrication of plastic materials. These composite materials maintain high heat dissipation effectiveness while being amenable to standard manufacturing processes like injection molding, thereby reducing overall manufacturing complexity despite the advanced material properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The material effectively shields against high temperatures, preventing burns and reducing heat signatures, thereby enhancing user safety and reducing the risk of detection by thermal imaging, while also protecting devices from overheating and damage.
Implementation Method 1
A heat-shielding or blocking, heat-dissipating, and heat signature-reducing material layer is integrated into the housing of electronic devices and battery packs, using materials like copper shielding plastic or copper impregnated polymers
Implementation Method 2
A heat-shielding or blocking, heat-dissipating, and heat signature-reducing material layer is integrated into the housing of electronic devices and battery packs
Data Source
AI summary
Systems, methods and articles having a heat-shielding or blocking, heat-dissipating and/or heat signature-reducing material layer or coating are disclosed. In one example, the heat-shielding or blocking, heat-dissipating and/or heat signature-reducing material completely covers the interior of a housing having a plurality of battery cells removably disposed therein. Other examples include a heat-shielding or blocking, heat-dissipating and/or heat signature-reducing material layer having anti-static, anti-radio frequency (RF), anti-electromagnetic interference (EMI), anti-tarnish, and/or anti-corrosion materials and properties that effectively protect battery-operated devices and/or the batteries that power them from damage or diminished operation.