Heat Dissipating Assembly With Bore-Driven Thermosyphon Loop
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Solution Overview
Problem
Existing heat dissipating assemblies in electronic devices face challenges in achieving efficient thermal performance while maintaining device integrity and appearance, particularly due to inefficiencies in cooling fluid circulation and the need for pumps, which hinder miniaturization and increase energy consumption.
Innovation Solution
A heat dissipating assembly utilizing a closed loop of tubes with a fluid that generates a two-phase, unidirectional flow through a pressure difference created by varying bore sizes, eliminating the need for a pump and allowing for efficient heat transfer between components without compromising the device's mechanical design or appearance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a pump is used to drive cooling fluid circulation, then heat dissipation efficiency is improved, but device complexity and energy consumption increase
Solution Approach 1:
The invention extracts and removes the pump component from the cooling system. By using a thermosyphon effect with phase change material, the system achieves passive fluid circulation without mechanical pumping components, thereby reducing device complexity while maintaining heat dissipation efficiency
Solution Approach 2:
The cooling system utilizes self-service through natural convection and phase change mechanisms. The working fluid automatically circulates through evaporation at the heat source and condensation at the heat sink, eliminating the need for external power-driven pumps and reducing system complexity
2Reliability
If a pump is used to drive cooling fluid circulation, then heat dissipation efficiency is improved, but energy consumption increases
Solution Approach 1:
The system performs self-service by utilizing natural thermodynamic processes (phase change and convection currents) to drive fluid circulation. This eliminates energy consumption associated with electrical pumps while maintaining effective heat transfer from the heat source to the heat sink
Solution Approach 2:
The invention replaces the mechanical pump system with a thermodynamic-based passive circulation system. The phase change material undergoes evaporation and condensation cycles that naturally drive fluid flow, substituting mechanical energy input with thermal energy-driven natural convection
3Volume of moving object
If the device is miniaturized, then portability is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The invention employs phase transitions of the working fluid (evaporation at the heat source, condensation at the heat sink) to enable efficient heat transfer in a compact form. The latent heat absorption and release during phase changes provide high heat dissipation density suitable for miniaturized devices
Solution Approach 2:
The heat dissipation system is nested within the compact device structure. The first and second tubes containing the phase change material are integrated into the limited space of the miniaturized device, with the heat source and heat sink positioned in close proximity to maximize heat transfer efficiency in a small volume
4Area of stationary object
If cooling fluid is used to transfer heat from host to screen, then heat dissipation area is increased, but transmission efficiency is affected by opening and closing angles
Solution Approach 1:
The invention incorporates a dynamic barrier structure that automatically adjusts its position based on the relative angle between the host and screen. The barrier moves to maintain optimal positioning in the cooling fluid passage, ensuring consistent heat transfer efficiency regardless of the device's opening or closing state
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal performance by enabling effective heat transfer without the need for pumps, maintaining device integrity and reducing energy consumption, while allowing for further miniaturization and improved thermal management across different device states.
Implementation Method 1
Heat generated by the heat source is transferred to the first tube. The fluid absorbs the heat which is transferred to the first tube and the heat is transferred to the second tube with the fluid for heat dissipating.
Implementation Method 2
a two-phase and unidirectional circulated flow is produced so as to enhance thermal performance
Implementation Method 3
a two-phase, unidirectional flow through a pressure difference created by varying bore sizes
Data Source
AI summary
A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.