Heat Dissipating Structure With Temperature-Responsive Deformation
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Solution Overview
Problem
Existing two-phase liquid cooling systems for high power density heat dissipating devices suffer from inconsistent heat dissipation due to uneven liquid distribution, leading to reduced cooling efficiency and potential overheating or overcooling of devices.
Innovation Solution
A heat dissipating structure that includes a cold plate, a liquid pipe with a deformation structure that changes cross-sectional area in response to ambient temperature changes, and a cooling capacity distribution unit to manage the flow rate of the heat conducting liquid, ensuring balanced heat dissipation across multiple devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If two-phase liquid cooling is used to cool multiple heat dissipating devices, then cooling capacity is improved, but liquid distribution becomes uneven causing flow resistance mismatch
Solution Approach 1:
The patent introduces a deformation structure that dynamically adjusts the liquid pipe's internal cross-sectional area in response to temperature changes. When temperature increases, the deformation structure expands to increase flow resistance, and when temperature decreases, it contracts to reduce flow resistance. This dynamic adjustment mechanism balances liquid distribution across multiple heat dissipating devices, ensuring stable circulation while maintaining high cooling capacity.
Solution Approach 2:
The patent changes the physical parameter of the liquid pipe (internal cross-sectional area) in response to temperature variations. The deformation structure's cross-sectional area is inversely proportional to ambient temperature, creating a compensatory effect that balances flow resistance across different thermal conditions and devices.
2Temperature
If one device dissipates substantially more heat than others, then cooling demand increases, but flow resistance increases reducing liquid flow rate
Solution Approach 1:
The deformation structure acts as a passive feedback mechanism that automatically responds to temperature differences. Devices dissipating more heat experience higher temperatures, which cause the deformation structure to expand and increase flow resistance, thereby reducing liquid flow rate to that device. This self-regulating feedback loop balances the distribution of cooling liquid according to actual heat dissipation needs.
3Quantity of substance
If deformation structure cross-sectional area decreases with temperature increase, then flow resistance increases to reduce liquid flow, but this may restrict cooling to high heat dissipation devices
Solution Approach 1:
The deformation structure is positioned at specific locations within the liquid distribution system where it can locally adjust flow resistance without affecting the overall cooling capacity. By placing deformation structures strategically in branch lines or at critical junctions, the system achieves localized flow control that balances liquid distribution while maintaining adequate cooling supply to all devices, particularly those with high heat dissipation requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed structure dynamically adjusts the flow rate of the heat conducting liquid based on temperature changes, ensuring that devices dissipating more heat receive adequate cooling liquid while preventing overheating or overcooling, thus stabilizing the dryness of the liquid and improving cooling efficiency.
Implementation Method 1
a deformation structure configured in the liquid pipe and located at a position corresponding to the cold plate, where the deformation structure deforms as an ambient temperature changes
Implementation Method 2
the liquid flows through each branch liquid pipe, absorbs heat dissipated from the corresponding heat dissipating device, and evaporates into a gas-liquid two-phase state downstream of the cold plate
Implementation Method 3
the main liquid pipe is configured with a cooling capacity distribution unit configured to cause the gas-liquid two-phase heat conducting liquid to condense into a liquid state
Data Source
AI summary
A heat dissipating structure includes a cold plate configured to exchange heat with a heat dissipating device; a liquid pipe disposed at both ends of the cold plate, the liquid pipe being configured to transport heat conducting liquid; and a deformation structure configured in the liquid pipe and located at a position corresponding to the cold plate, wherein the deformation structure deforms as an ambient temperature changes. The deformation structure is configured in the heat dissipating structure to manage the flow rate of the heat conducting liquid. The deformation structure deforms at different ambient temperatures. Based on a relationship between the temperature and a deformation coefficient, the flow rate of the heat conducting liquid flowing through the liquid pipe can be controlled for different temperatures. Thus, a desired heat dissipating capacity can be provided to the heat dissipating device to satisfy the needs of users.