Heat Dissipating Fin with Overflow-Proof Structure
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Solution Overview
Problem
Conventional heat dissipating devices with flat-type fins have limited heat dissipating efficiency due to a draft angle requirement in the die casting process, which restricts fin height and number, and expose electronic devices to environmental damage when used outdoors.
Innovation Solution
A heat dissipating device with a heat dissipating fin and protruding member formed by a forming process, eliminating the need for a draft angle, and featuring overflow-proof structures to prevent metal overflow during die casting, allowing for increased fin height and number, and an accommodating box to protect electronic devices from environmental elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat-type heat dissipating fin is formed by die casting process with draft angle, then the fin can be manufactured with mold stripping, but the fin height is limited and the whole weight is heavy
Solution Approach 1:
The heat dissipating device is divided into two separate parts: the fin formed by extrusion process and the base formed by die casting process. This segmentation allows each part to be optimized independently - the fin can have vertical walls without draft angle constraints while the base can be manufactured using conventional die casting with mold stripping
Solution Approach 2:
The fin and base are combined through mechanical assembly (s插接结构) rather than integral forming. The fin's fixing portion is inserted into the base's accommodating space, creating a unified heat dissipating device that overcomes the limitations of both individual manufacturing processes
2Ease of manufacture
If a draft angle is applied to the fin for die casting, then the fin can be stripped from the mold, but the number of fins is reduced and heat dissipating area is insufficient
Solution Approach 1:
Separating the fin and base manufacturing processes allows the fin to be formed by extrusion without draft angle constraints, maximizing the number and density of fins that can be packed into the heat dissipating device
Solution Approach 2:
The fin is formed by extrusion in a vertical direction with horizontal cross-section, creating a structure with vertical walls and no draft angle requirement. This dimensional approach to manufacturing enables much higher fin density and greater total heat dissipating area
3Ease of manufacture
If the base is formed as flat plates, then the die casting process is simple, but the electronic device is exposed to wind and rain when attached outdoors
Solution Approach 1:
The base is designed to perform multiple functions: it serves as the mounting surface for attaching the heat dissipating device to the electronic device, provides structural support, and acts as a protective enclosure (box) that shields electronic components from environmental factors like wind and rain
4Productivity
If the fin height is increased to improve heat dissipation, then the heat dissipating efficiency improves, but the fin cannot be stripped from the mold with draft angle constraints
Solution Approach 1:
By separating fin manufacturing from base manufacturing, the fin can be made arbitrarily tall using extrusion without being constrained by mold stripping requirements, directly enabling higher heat dissipating efficiency
Solution Approach 2:
Changing the manufacturing process parameter from die casting (which requires draft angles) to extrusion (which allows vertical walls) enables the fin height parameter to be increased significantly without manufacturing constraints
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipating efficiency by increasing the number and height of fins, reducing weight, and provides protection for electronic devices from wind and rain when used outdoors.
Implementation Method 1
Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance. If the heat is accumulated in the electronic components of the electronic product without dissipating immediately, the electronic components may get damage due to the accumulated heat.
Implementation Method 2
Heat dissipating device is a significant component for electronic products. When an electronic product is operating, the current in circuit will generate unnecessary heat due to impedance.
Implementation Method 3
The heat dissipating fin and the protruding member are formed by a forming process (e.g. aluminum extrusion process)
Implementation Method 4
The heat dissipating fin and the protruding member of the invention both have overflow-proof structures capable of preventing the melt metal material from overflowing during the die casting process
Implementation Method 5
forms the base, which covers the fixing portion of the heat dissipating fin, by a die casting process with melt metal material
Data Source
AI summary
A heat dissipating device includes a base, a heat dissipating fin and a protruding member. The heat dissipating fin includes a heat dissipating portion, a fixing portion fixed in the base, and a first overflow-proof structure. The first overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the first overflow-proof structure is larger than a width of the heat dissipating portion. A first hole is formed on the heat dissipating portion and the first overflow-proof structure. The protruding member includes a second overflow-proof structure and a first protruding portion protruding from an upper surface of the second overflow-proof structure. The protruding member is disposed in the first hole, and a lower surface of the second overflow-proof structure and a lower surface of the first overflow-proof structure are coplanar.