Heat Dissipating Housing for Pluggable Electronic Devices
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Solution Overview
Problem
Conventional heat dissipation mechanisms for high-speed solid-state drives (SDDs) are inadequate, leading to increased waste heat and potential malfunctions due to reliance on the system for heat dissipation.
Innovation Solution
A heat dissipating housing with a modular design that integrates a metal base and an upper cover with an enclosed cavity containing an operating fluid, which cyclically evaporates and condenses to efficiently dissipate heat without relying on external systems, enhancing heat conduction through capillary structures and thermal interface materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional heat dissipation mechanism relying on system is used, then device complexity is reduced, but heat dissipation performance is inadequate for high-speed SDDs
Solution Approach 1:
The housing structure performs heat dissipation autonomously through its own integrated design, including heat conduction paths and fluid circulation channels, without requiring external system support. The housing itself serves as the heat dissipation system, enabling independent heat management for the SDD.
Solution Approach 2:
The patent utilizes phase change of operating fluid (evaporation and condensation) within the enclosed cavity to transfer heat efficiently. The fluid absorbs heat during evaporation and releases it during condensation, providing high-efficiency heat dissipation for high-speed SDDs.
2Reliability
If modular heat dissipating housing is integrated, then heat dissipation performance is improved, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function directly into the housing structure by integrating heat conduction paths, fluid circulation channels, and enclosure into a single unified housing design. This consolidation achieves effective heat dissipation while avoiding the complexity of separate external heat dissipation components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat dissipation for SDDs, preventing heat accumulation and improving performance by allowing independent heat management, reducing the need for external heat dissipation mechanisms and enhancing overall efficiency.
Implementation Method 1
an operating fluid cyclically performing evaporation and condensation in the enclosed cavity
Implementation Method 2
an operating fluid cyclically performing evaporation and condensation in the enclosed cavity
Implementation Method 3
The base is made of a metal material
Data Source
AI summary
A pluggable electronic device includes a base, a heat source module and an upper cover. The base is made of a metal material. The heat source is disposed at the base. The upper cover covers the heat source module, is connected to the base, and includes an enclosed cavity and an operating fluid cyclically performing evaporation and condensation in the enclosed cavity.