Heat Dissipating Layer for Electronic Device Thermal Management
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Solution Overview
Problem
Electronic devices, particularly speaker boxes, experience poor heat conduction leading to localized overheating due to inadequate heat dissipation, as they generate more heat with increased power consumption and functional complexity.
Innovation Solution
A heat dissipation structure incorporating a heat dissipating layer on the rear cover in contact with the mainboard, battery, and speaker box, utilizing thermally conductive materials for improved thermal conductivity and heat transfer, along with a heat equalizing layer for even heat distribution and a heat insulation layer to manage temperature rises.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the volume and power of the speaker box are increased to achieve desired sound effects, then the sound quality is improved, but the heat generated by the speaker box increases
Solution Approach 1:
A heat dissipating layer is introduced as an intermediary component between the speaker box and the rear cover. This layer serves as a thermal mediator that conducts heat away from the speaker box to the rear cover, enabling the speaker box to operate at high power while preventing excessive temperature buildup.
2Adaptability or versatility
If the power consumption is increased to implement more functions, then the functionality is improved, but the heat generation increases
Solution Approach 1:
The heat dissipating layer acts as a thermal management intermediary that enables higher power consumption for enhanced functionality without proportional increase in temperature. It provides a dedicated heat conduction pathway that decouples the relationship between power consumption and temperature rise.
3Temperature
If the heat dissipating layer is made with high thermal conductivity material, then the heat conduction effect is improved, but the cost increases
Solution Approach 1:
The heat dissipating layer is constructed using composite materials that balance thermal conductivity with manufacturing cost. Rather than using pure high-cost metals, the patent employs composite structures or materials that provide adequate heat dissipation performance at lower cost, making the solution economically viable for mass production.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively dissipates heat from the mainboard, battery, and speaker box, preventing local overheating and ensuring equalized heat dissipation across the electronic device, enhancing user experience by maintaining optimal operating temperatures.
Implementation Method 1
a heat dissipating layer is disposed on the rear cover... the first region of the heat dissipating layer is in contact with the first shield cover of the mainboard... the second region of the heat dissipating layer is in contact with a surface of the battery... the third region of the heat dissipating layer is in contact with a surface of the speaker box
Implementation Method 2
An adhesive used in the adhesive manner is an adhesive for heat conduction... a flux used in the welding manner is a thermally conductive flux... thermal conductivity between the heat dissipating layer and the speaker box may be improved, and heat transfer efficiency may be increased
Data Source
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AI summary
The present invention provides a housing of a user terminal and a user terminal. The housing is disposed with a jack. A sealing member is disposed at the jack on an inner side of the housing. The sealing member is disposed with an opening. The opening is located at the middle of the jack. In addition, when a pin passes through the sealing member through the jack, the opening on the sealing member is opened, and when the pin is pulled out of the sealing member, the opening on the sealing member is closed. Therefore, by disposing the sealing member at a pinhole at which a card tray of the user terminal is removed, the pinhole can be sealed with a small occupied space and low costs, to achieve a waterproof effect.