Heat-Dissipating Member With Liquid Crystal Silane Coupling Agent
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Solution Overview
Problem
Current heat-dissipating members for electronic devices face challenges in achieving high thermal conductivity and controlled thermal expansion coefficients, with existing methods limited by the properties of inorganic materials and their compatibility with resins, leading to issues like thermal distortion and reduced lifespan due to peeling of wiring.
Innovation Solution
A composition that directly bonds inorganic fillers using a liquid crystal silane coupling agent, allowing for high thermal conductivity and controlled thermal expansion coefficients, achieved by bonding thermally conductive inorganic fillers with different thermal expansion coefficients and adding a third filler to fill gaps and enhance stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a large amount of inorganic filling material is added to increase thermal conductivity, then thermal conductivity is improved, but the material becomes easily cracked and processability deteriorates
Solution Approach 1:
The invention uses a composite material system consisting of inorganic filler particles (such as aluminum nitride, boron nitride, or silicon carbide) dispersed in a polymer matrix. This composite structure allows the inorganic filler to provide high thermal conductivity while the polymer matrix maintains flexibility and crack resistance, resolving the contradiction between thermal conductivity improvement and reliability maintenance.
2Loss of energy
If inorganic materials are used for heat dissipation, then thermal conductivity is improved, but thermal expansion coefficient control becomes difficult leading to thermal distortion
Solution Approach 1:
The invention controls the thermal expansion coefficient by carefully selecting and adjusting the types and proportions of inorganic filler materials. Different inorganic fillers have different thermal expansion coefficients, and by changing their composition ratios, the overall thermal expansion coefficient of the composite can be tuned to match specific application requirements, thereby preventing thermal distortion while maintaining high thermal conductivity.
3Loss of energy
If inorganic materials are used to improve heat dissipation, then thermal conductivity is improved, but compatibility with resin decreases leading to peeling and reduced lifespan
Solution Approach 1:
The invention introduces a coupling agent as an intermediary substance that chemically or physically bonds to both the inorganic filler particles and the polymer matrix. This coupling agent improves the interfacial adhesion between the inorganic filler and resin, preventing peeling and enhancing the overall reliability and lifespan of the heat-dissipating member while maintaining the high thermal conductivity provided by the inorganic filler.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a heat-dissipating member with very high thermal conductivity, controlled thermal expansion, excellent chemical stability, heat resistance, and mechanical strength, suitable for applications where thermal distortion is a concern.
Implementation Method 1
a liquid crystal silane coupling agent, wherein the mesogenic site has liquid crystallinity
Implementation Method 2
the other end of the first coupling agent is bonded to the other end of the second coupling agent through curing treatment
Implementation Method 3
a thermally conductive second inorganic filler
Data Source
AI summary
The inventions are: a composition capable of forming a heat-dissipating member that has high thermal conductivity and in which the thermal expansion coefficient can be controlled; and a heat-dissipating member. This composition for a heat-dissipating member comprises a thermally conductive first inorganic filler bonded to one end of a first coupling agent, and a thermally conductive second inorganic filler bonded to one end of a second coupling agent, the composition being characterized in that: at least one of the first coupling agent and the second coupling agent is a liquid crystal silane coupling agent; the other end of the first coupling agent and the other end of the second coupling agent each have a functional group bondable with one another; and the other end of the first coupling agent bonds with the other end of the second coupling agent by a curing treatment.