Heat Dissipating Module With Elastic Fixing Structure
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Solution Overview
Problem
Existing heat dissipating modules in electronic devices, such as notebook computers, face challenges in applying uniform pressure to electronic components due to multidirectional and complicated forces generated at fastening areas, affecting process reliability and production yield.
Innovation Solution
A heat dissipating module with a fixing structure that includes arcuate elastic portions and position limiting holes, allowing for slidably disposed end portions on the heat collecting plate, which deform elastically to apply only normal forces, ensuring uniform pressure and easy calculation of forces applied to the electronic component.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a spring plate is used to fasten the heat collecting plate to the base, then the electronic component can be sandwiched and held in place, but multidirectional and complicated forces are generated at the fastening area, making the pressure non-uniform and difficult to calculate
Solution Approach 1:
The fixing structure is divided into multiple independent fastening points (first fastening point and second fastening point) distributed at different locations on the heat collecting plate. Each fastening point independently applies force through its own elastic component, segmenting the overall fastening function into simpler, more controllable units that reduce complex force interactions.
Solution Approach 2:
Elastic components (elastic strips or elastic buttons) are locally installed at specific fastening points on the heat collecting plate. These localized elastic elements provide targeted compression force at each fastening point, ensuring uniform pressure distribution across the electronic component while maintaining simple, calculable force characteristics at each location.
2Ease of manufacture
If traditional fastening methods are used, then the structure can be assembled, but the pressure applied to the electronic component is non-uniform and difficult to calculate, affecting production yield
Solution Approach 1:
The fixing structure utilizes elastic components with specific elastic coefficients that can be selected and adjusted to achieve desired pressure parameters. By changing the elastic coefficient, thickness, or material properties of the elastic strips or buttons, uniform and calculable pressure can be achieved while maintaining ease of assembly through simple fastening operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures uniform and calculable pressure on electronic components, enhancing process reliability and production yield by maintaining consistent contact and reducing the complexity of force distribution.
Implementation Method 1
The arcuate elastic portion is adapted to be fastened to the heat collecting plate and the base, such that the electronic component is sandwiched in between the heat collecting plate and the base
Implementation Method 2
The heat conducting member is connected between the heat dissipating unit and the heat collecting plate
Data Source
AI summary
A heat dissipating module includes a heat dissipating unit, a heat collecting plate with a position limiting hole, a heat conducting member connected between the heat dissipating element and the heat collecting plate, and a fixing structure. The fixing structure includes two end portions, an arcuate elastic portion, and a position limiting portion connected to the arcuate elastic portion and extending through the position limiting hole. Each end portion is slidably disposed on the heat collecting plate. The arcuate elastic portion is connected between the two end portions and adapted to be fastened to the heat collecting plate and a base, such that an electrical component is sandwiched in between the heat collecting plate and the base.