Heat Dissipating Module Assembly via Direct Lateral Plate Fixing
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Solution Overview
Problem
Conventional heat dissipating modules for electronic devices are complex and time-consuming to assemble, with potential for stress-induced damage to solder paste and pins due to gaps between heat generation elements and casings, leading to reduced heat dissipation efficacy and increased fabrication costs.
Innovation Solution
A heat dissipating module with a fastening assembly that directly attaches heat generation elements to the casing's lateral plates, eliminating gaps and allowing for direct heat transfer, simplified assembly, and enhanced structural strength by combining the casing and circuit board through a reflow furnace.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipating element is interposed between the heat generation element and the lateral wall to fill gaps, then heat dissipation efficacy is improved, but device complexity and assembly time increase
Solution Approach 1:
The invention removes the heat dissipating element from the assembly structure, eliminating the need for additional components and simplifying the assembly process while maintaining effective heat dissipation through direct contact between the heat generation element and lateral wall
Solution Approach 2:
The invention merges the heat generation element directly with the lateral wall through fixing elements, eliminating the intermediate heat dissipating element and creating a more integrated and simpler assembly structure
2Strength
If fixing elements are used to attach the heat generation element to the lateral wall, then structural strength is improved, but stress-induced damage to solder paste and pins occurs
Solution Approach 1:
The invention introduces a buffer layer or cushioning structure between the fixing elements and the heat generation element that absorbs and distributes stress, preventing direct transmission of tightening forces to the solder paste and pins while still securing the component firmly
3Manufacturing precision
If the heat generation element is fixed on the circuit board before assembly, then positioning is improved, but alignment difficulty and assembly time increase
Solution Approach 1:
The invention incorporates positioning structures or alignment features into the lateral wall or fixing elements that automatically guide and position the heat generation element during assembly, eliminating the need for pre-fixing to the circuit board and reducing alignment time
Solution Approach 2:
The assembly structure includes self-aligning features such as guide pins, tapered surfaces, or snap-fit mechanisms that automatically position the heat generation element correctly during installation, eliminating the need for manual alignment or pre-fixing operations
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation efficacy, reduces assembly complexity and costs, and minimizes the risk of solder paste cracking and pin damage, while increasing the structural strength of the module.
Implementation Method 1
the heat of the heat generation element 12 is transferred to the heat dissipating element 13 by thermal conduction and then transferred to the large-area lateral wall 102 to be dissipated away
Data Source
AI summary
A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away.