Heat Dissipating Element for High Power PCB Thermal Management
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Solution Overview
Problem
Conventional electronic systems face challenges in effectively dissipating heat from high-power components without increasing costs or system size, particularly in fan-less designs where active heat generating components require efficient thermal management.
Innovation Solution
The electronic system employs a heat dissipating element, such as a metallic plate, integrated into the enclosure to provide thermal coupling for high-power components, while passive components are placed on a separate side to optimize heat dissipation without using fans, reducing costs and enabling a slim design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional cooling mechanisms (heat sinks, fans) are used for high-power components, then heat dissipation effectiveness is improved, but system cost and complexity increase
Solution Approach 1:
The patent merges the cooling function with the system enclosure by integrating a heat dissipation plate directly into the enclosure structure. This eliminates the need for separate heat sinks and fans, reducing component count and system complexity while maintaining effective heat dissipation for high-power components through direct thermal coupling.
Solution Approach 2:
The enclosure structure itself serves the dual function of housing components and dissipating heat. The heat dissipation plate integrated into the enclosure passively manages thermal loads without requiring active cooling components, allowing the system to self-regulate temperature through its structural design.
2Temperature
If active cooling components (fans, large heat sinks) are added, then heat dissipation capability is improved, but system size and volume increase
Solution Approach 1:
The cooling function is merged into the enclosure structure through an integrated heat dissipation plate, eliminating the need for separate bulky heat sinks or fan assemblies. This integration maintains compact system volume while providing effective passive heat dissipation for high-power components.
3Volume of moving object
If high-power components are placed close to each other for compact design, then space utilization is improved, but thermal management difficulty increases
Solution Approach 1:
The patent applies local thermal management by providing dedicated heat dissipation pathways for high-power components through the integrated heat dissipation plate. Components are strategically positioned to utilize the plate's thermal conductivity, with high-power devices placed in direct thermal contact with the plate while other components are positioned accordingly, creating localized thermal zones that manage heat effectively in compact arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively maintains component temperatures within acceptable ranges, reducing thermal management costs and allowing for a compact design by strategically placing high-power components in close proximity to the heat dissipating element.
Implementation Method 1
The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components
Data Source
AI summary
An electronic system includes a printed circuit board (PCB), and a heat dissipating element. The PCB includes one or more first electronic components mounted on a first side of the PCB, and one or more second electronic components mounted on a second side of the PCB. The first electronic components have a power consumption that is greater than a threshold and have a height over the first side of the PCB that is higher than any other electronic components mounted on the first side of the PCB. At least one of the second electronic components has a height over the second side of the PCB that is higher than the height of the first electronic components. The heat dissipating element is adjacent to the first electronic components so as to provide a thermal coupling for dissipating heat generated by the first electronic components.