Heat Dissipating Structure With Position-Adjusting Unit
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Solution Overview
Problem
Conventional heat dissipating structures in electronic devices are inefficient in removing heat due to closely arranged components, leading to increased internal temperatures, which affects the reliability and lifetime of electronic apparatuses.
Innovation Solution
A heat dissipating structure comprising a position-adjusting unit with an elastic element, a first heat dissipating element, a second heat dissipating element, and a first heat conducting element, allowing horizontal adjustment and efficient heat transfer without the need for additional space for rotational movement, enabling heat to be dissipated through an opening in the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional heat dissipating structures are used with closely arranged components, then the electronic device size is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat dissipating element is designed with movable characteristics, allowing it to change position between a retracted state (within housing) and an extended state (partially outside housing). This dynamic configuration enables the system to adapt to space constraints while maintaining effective heat dissipation capability, resolving the contradiction between compact size and heat dissipation efficiency.
Solution Approach 2:
The heat dissipating element extends in a direction perpendicular to the main housing plane, utilizing the third dimension for heat dissipation. By protruding partially outside the housing, the element increases its exposed surface area for heat dissipation without significantly increasing the footprint area of the electronic device, thus resolving the size-heat dissipation contradiction.
2Device complexity
If heat dissipating elements are arranged closely, then device compactness is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The movable heat dissipating element can change its position and exposure level, allowing it to optimize its heat dissipation surface area according to thermal conditions. When high heat dissipation is needed, the element can extend further outside the housing, maintaining effectiveness even in compact arrangements.
Solution Approach 2:
The heat dissipating element is designed with varying local characteristics, including different surface areas at different positions along its length. The portion outside the housing provides enhanced heat dissipation where thermal conditions are more favorable, while the portion inside handles heat from closely arranged components, creating localized heat dissipation zones that improve overall efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces internal temperatures by allowing efficient heat dissipation from the electronic device, enhancing the reliability and lifetime of the apparatus while minimizing the housing size.
Implementation Method 1
The position-adjusting unit has an elastic element. The position-adjusting unit adjusts a horizontal position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.
Implementation Method 2
A first end of the first heat conducting element contacts with the first heat dissipating element, and a second end of the first heat conducting element contacts with the second heat dissipating element.
Implementation Method 3
The second heat dissipating element contacts with the heat source.
Implementation Method 4
the first heat dissipating element extrudes from the housing through the opening... the heat generated by the heat source in the housing can be dissipated out of the housing through the first heat dissipating element
Implementation Method 5
the first heat dissipating element extrudes from the housing through the opening... dissipate heat externally
Data Source
AI summary
A heat dissipating structure for a heat source includes a position-adjusting unit, a first heat dissipating element, a second heat dissipating element and a first heat conducting element. The position-adjusting unit has an elastic element. The first heat dissipating element is connected with the position-adjusting unit. The second heat dissipating element contacts with the heat source. One end of the first heat conducting element contacts with the first heat dissipating element, and the other end of the first heat conducting element contacts with the second heat dissipating element. The position-adjusting unit adjusts the position of the first heat dissipating element relative to the second heat dissipating element by the elastic element.