Heat-Dissipating Resin Composition for Passive Thermal Management

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional heat-dissipating resin compositions are inefficient in dissipating heat due to low emissivity in a wide far-infrared wavelength range, particularly in smaller, lighter, and thinner mobile devices like smartphones and tablets, where incorporating fans or heat sinks is challenging.

Innovation Solution

A heat-dissipating resin composition with a rubber material having an average emissivity of 80% or higher in the 5 μm to 20 μm wavelength range, combined with fillers of 15 μm or smaller grain diameter and an aspect ratio of 3 to 10, enhancing emissivity to 90% or higher across this range, allowing efficient heat dissipation without fans or heat sinks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional heat-dissipating resin compositions are highly filled with alumina, then thermal conductivity is improved, but emissivity in the far-infrared wavelength range remains low

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidemissivity in far-infrared wavelength range

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

The patent uses a composite resin composition containing both alumina particles (for thermal conductivity) and rubber particles (for high emissivity in far-infrared range). This composite structure allows simultaneous achievement of heat conduction and thermal radiation properties, resolving the contradiction between thermal conductivity and emissivity.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent changes the physical parameters of the filler particles by controlling the particle size distribution and aspect ratio of alumina particles, and by selecting appropriate rubber particle sizes. This optimization allows the composite to achieve both high thermal conductivity and high emissivity across the far-infrared wavelength range.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If fillers with higher emissivity in wavelength range longer than 11 μm are added, then emissivity in that range is improved, but emissivity in the 6 μm to 11 μm range becomes lower

Engineering Contradiction:

Improveemissivity in specific wavelength rangeVSAvoidemissivity across entire far-infrared wavelength range

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by using different filler materials and size distributions to optimize different wavelength ranges. Alumina particles optimize the 6-11 μm range while rubber particles optimize the 11-20 μm range, creating a composition with uniformly high emissivity across the entire far-infrared spectrum.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

By combining multiple materials (alumina and rubber) with complementary emissivity characteristics across different wavelength ranges, the patent creates a composite that achieves broad-spectrum high emissivity, preventing the trade-off between specific wavelength ranges.

Inventive Principle:

Principle #40Composite materials

3Loss of energy

If fans or heat sinks are incorporated for heat dissipation, then heat dissipation ability is improved, but device size, weight, and thickness increase

Engineering Contradiction:

Improveheat dissipation abilityVSAvoiddevice weight and size

Core Design Contradiction:

Loss of energyVSWeight of moving object

Solution Approach 1:

The patent replaces mechanical heat dissipation systems (fans, heat sinks) with a chemical/physical solution based on thermal radiation. The resin composition with high emissivity enables passive heat dissipation through infrared radiation, eliminating the need for mechanical components and reducing device weight and complexity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The resin composition itself provides heat dissipation functionality through its intrinsic thermal radiation properties. The material serves multiple functions simultaneously: structural support, thermal conduction, and thermal radiation, eliminating the need for separate dedicated heat dissipation components.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition effectively converts heat into far-infrared energy for efficient dissipation, suppressing temperature rise in heat-generating devices, and is suitable for compact electronic devices without the need for fans or heat sinks.

Implementation Method 1

application of the heat-dissipating resin composition to a heat-generating element enables efficient conversion of heat generated from a heat-generating element into far-infrared and dissipation of the heat into the air

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS10407604B2Heat-dissipating resin composition, and component and electronic device including the same

Publication Date: 2019.09.10 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

Provided is a heat-dissipating resin composition including: a rubber material having an average emissivity of 80% or higher in a wavelength range from 5 μm to 20 μm; and a filler having a grain diameter of 15 μm or smaller and an aspect ratio of 3 to 10, wherein the heat-dissipating resin composition has an emissivity of 90% or higher in the wavelength range from 5 μm to 20 μm.