Heat Dissipating Structure with Segmented Fastening and Thermal Barrier
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Solution Overview
Problem
Conventional heat dissipating structures in electronic devices often result in fastening members becoming high in temperature, which can be hazardous when exposed externally, and fail to efficiently manage heat dissipation due to heat conduction issues between components.
Innovation Solution
A heat dissipating structure comprising a bracket and a heat sink, where the heat sink is in close contact with the electronic component, and the bracket is made of a less heat-conductive material to prevent heat transfer to the housing, with fastening members positioned to avoid exposure and ensure efficient heat dissipation through air channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipating member is kept in close contact with an electronic component that generates heat, then heat dissipation efficiency is improved, but the fastening member becomes high in temperature and may be hazardous when exposed externally
Solution Approach 1:
The patent divides the fastening system into two separate fastening members: a first fastening member that connects the heat dissipating member to the electronic component (exposed to heat), and a second fastening member that connects the bracket to the housing (not exposed to heat). This segmentation isolates the heat-exposed fastening function from the externally accessible fastening function, eliminating the hazard while preserving heat dissipation efficiency.
Solution Approach 2:
The patent introduces a bracket as an intermediary component between the heat dissipating member and the housing. The bracket serves as a thermal barrier that prevents heat from reaching the second fastening member and the housing, while still allowing the heat dissipating member to effectively transfer heat away from the electronic component.
2Temperature
If heat-generating components are pressed against a side wall of a bracket to dissipate heat, then heat dissipation is achieved, but heat conduction issues reduce efficiency
Solution Approach 1:
The patent applies different material properties to different parts of the system: the heat dissipating member is made of highly heat-conductive material to efficiently extract heat from the electronic component, while the bracket is made of less heat-conductive material to prevent heat from reaching the housing. This local differentiation of thermal properties optimizes heat dissipation efficiency while preventing unwanted heat transfer.
3Ease of manufacture
If fastening members are used to fix the heat dissipating member onto the housing, then assembly is achieved, but the fastening member becomes high in temperature and should not be exposed externally
Solution Approach 1:
The patent segments the fastening function into two independent fastening members with distinct roles: the first fastening member handles the heat-exposed connection between the heat dissipating member and electronic component, while the second fastening member handles the external connection between the bracket and housing. This segmentation allows the assembly function to be maintained while eliminating temperature exposure hazards from externally accessible fastening members.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure effectively dissipates heat generated by electronic components, keeps fastening members at a safe temperature, and prevents the housing from overheating, enhancing safety and efficiency while allowing for cost-effective and space-efficient design.
Implementation Method 1
a heat dissipating member (40) ... dissipate the heat generated by the integrated circuit 20
Implementation Method 2
the bracket 30 is made of a less heat-conductive material to prevent heat transfer to the housing
Implementation Method 3
a first fastening member configured to be inserted into a first fastening hole provided to the bracket 30, and into a fastening hole provided to the heat dissipating member 40, and assemble the electronic component 20 to the bracket 30 and the heat dissipating member 40
Implementation Method 4
a second fastening member configured to be inserted into a second fastening hole provided to the bracket 30, and into a fastening hole provided to the housing 50, and assemble the bracket 30 to the housing 50, while the heat dissipating member 40 is pressed against the housing 50
Data Source
AI summary
A heat dissipating structure includes an integrated circuit; a bracket; a heat sink; a housing; a first fastening member that is inserted into a first fastening hole provided to the bracket, and is inserted into a fastening hole provided to the heat sink, and that assembles the integrated circuit to the bracket and the heat sink, while a surface of the integrated circuit contacts with the bracket, and another surface contacts with the heat sink; and a second fastening member that is inserted into a second fastening hole provided to the bracket, and into a fastening hole provided to the housing, and assembles the bracket to the housing. The heat sink includes one surface that contacts with the housing, the one surface being on a side opposite to a surface contact with the integrated circuit, and the one first fastening member is positioned spaced from the housing.