Heat-dissipating sheet with recess and wing for compact electronics
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Solution Overview
Problem
Small electronic devices without active heat dissipation methods rely primarily on conduction and radiation for heat transfer, leading to increased heat resistance and the formation of 'hotspots' due to limited heat dissipation, which conventional thermal pads or pastes cannot effectively address.
Innovation Solution
An electronic device design incorporating a heat-conductive member with a recess and a heat-dissipating sheet that covers the recess, featuring a contact portion, bent portion, and wing portion to reduce heat resistance and enhance heat conductivity and dissipation efficiency, preventing hotspot formation on the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal pad or thermal paste is added between the heat-conductive member and the housing to reduce heat resistance, then heat conduction is improved, but the surface temperature of the housing increases creating a hotspot
Solution Approach 1:
The heat-dissipating sheet is divided into three functional segments: a contact portion that covers the recess and contacts the heat-conductive member, a bent portion that connects the contact portion to the wing portion, and a wing portion that extends toward the housing. This segmentation allows heat to be dissipated through multiple pathways rather than concentrating at a single point on the housing surface.
Solution Approach 2:
The heat-dissipating sheet extends from the recess area toward the housing, creating a three-dimensional heat dissipation pathway. The wing portion projects from the heat-conductive member at a distance, establishing a spatial gradient for heat transfer that distributes thermal energy across a larger volume and surface area, preventing localized hotspot formation.
2Volume of moving object
If the electronic device is made compact to reduce size, then portability is improved, but heat dissipation efficiency deteriorates due to limited space for heat management
Solution Approach 1:
The heat-dissipating sheet is nested within the housing structure, with the contact portion fitting into the recess of the heat-conductive member. This nested arrangement maximizes heat dissipation functionality within the limited internal volume of the compact device, allowing efficient heat management without increasing overall device size.
Solution Approach 2:
The heat-dissipating sheet utilizes the vertical dimension by extending from the heat-conductive member toward the housing surface. This three-dimensional configuration allows heat to be dissipated through multiple spatial dimensions rather than being constrained to a two-dimensional plane, improving heat dissipation efficiency within the compact device volume.
3Temperature
If the distance between the heat-conductive member and the housing is reduced to less than 0.5 mm to improve heat conduction, then heat resistance decreases, but hotspot formation increases on the housing surface
Solution Approach 1:
The heat-dissipating sheet segments the heat transfer pathway into multiple zones: the contact portion in direct thermal contact with the heat-conductive member, the bent portion that transitions the thermal pathway, and the wing portion that distributes heat toward the housing. This segmentation prevents heat from concentrating at a single interface point, thereby reducing hotspot formation even when the overall distance is small.
Solution Approach 2:
The heat-dissipating sheet acts as an intermediary element between the heat-conductive member and the housing. It provides an extended thermal pathway that mediates the heat transfer process, distributing thermal energy across a larger area of the housing surface rather than allowing direct, concentrated heat transfer at a single point, thus preventing hotspot formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces heat resistance and improves heat dissipation efficiency within the electronic device, even in compact sizes, by utilizing a heat-dissipating sheet that covers the recess and strategically positions the wing portion to manage heat transfer effectively.
Implementation Method 1
The heat inside the electronic device is transmitted to the housing thereof by conduction and radiation
Implementation Method 2
The heat inside the electronic device is transmitted to the housing thereof by conduction and radiation
Implementation Method 3
In a small electronic device without the means for active heat dissipation, the air inside the electronic device is almost motionless
Data Source
AI summary
An electronic device is provided. The electronic device includes a heat source, a heat-conductive member and a heat-dissipating sheet. The heat-conductive member includes a recess, wherein the recess is thermally connected to the heat source. The heat-dissipating sheet is attached to the heat-conductive member, wherein the heat-dissipating sheet covers the recess.