Heat-Dissipating Structure for Electronic Device Thermal Management
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Solution Overview
Problem
In wireless communication systems, particularly with 5G networks using high-frequency millimeter waves, path loss increases, leading to shorter propagation ranges and reduced service coverage, and the integration of RFIC and antenna arrays in electronic devices faces heat-related deterioration issues due to limited internal space.
Innovation Solution
An electronic device with a heat-dissipating structure that includes a housing with a front and rear plate, an intermediate plate, and separate heat-dissipating structures for the communication processor and antenna module, allowing for effective heat dissipation and preventing overheating, even in confined spaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If RFIC and antenna array are integrated in a module to decrease path loss, then wireless communication performance is improved, but heat accumulation occurs leading to deterioration of the antenna module
Solution Approach 1:
The patent divides the antenna module into multiple independent heat dissipation zones by placing heat dissipation structures at different locations (first heat dissipation structure near RFIC, second heat dissipation structure near antenna array). This segmentation allows heat from different components to be dissipated separately, preventing heat accumulation while maintaining the integrated module design for improved wireless communication performance.
2Temperature
If heat dissipation structures are added to manage thermal issues, then temperature control is improved, but the already limited inner space of the electronic device becomes more constrained
Solution Approach 1:
The patent utilizes the z-axis dimension (thickness direction) by placing heat dissipation structures on different faces of the intermediate plate - one heat dissipation structure on the first face facing the display and another on the second face facing the rear plate. This three-dimensional arrangement allows effective heat dissipation while minimizing the footprint in the planar dimensions, thus managing temperature control without significantly consuming the limited inner space.
3Temperature
If multiple heat dissipation structures are placed on the intermediate plate, then heat dissipation effectiveness is improved, but the structural complexity of the device increases
Solution Approach 1:
The intermediate plate serves multiple functions: it provides structural support between the display and rear plate, acts as a mounting platform for electronic components, and functions as a heat dissipation structure through its thermal conductivity and the integrated heat dissipation structures. By making the intermediate plate multi-functional, the patent achieves effective heat dissipation without adding separate dedicated heat sink components, thus reducing overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat-dissipating structure effectively manages heat generated by both the communication processor and antenna module, enhancing the device's performance by reducing the risk of overheating and maintaining service coverage while ensuring user safety.
Implementation Method 1
a first heat-dissipating structure extended between the first portion and the second portion along the second face
Data Source
AI summary
An electronic device according to various embodiments of the disclosure may include a housing including a front plate and a rear plate facing the front plate, a display exposed through at least part of the front plate, an intermediate plate interposed between the display and the rear plate, and including a first face facing the display and a second face facing the rear plate, a first printed circuit board interposed between the display and the intermediate plate, a first electronic component attached to a first portion of the second face, a second electronic component attached to a second portion, away from the first portion, of the second face, and a first heat-dissipating structure extended between the first portion and the second portion along the second face.