Heat-Dissipating Structure With Conductive Layer for Void Insulation

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Solution Overview

Problem

Void formation between a printed circuit board and a multilayer resin sheet can lead to deteriorated insulation properties due to irregularities and different potentials on the plate surface, compromising the heat-dissipating structure's effectiveness.

Innovation Solution

Incorporating a plate-shaped heat transfer member and a conductive layer between the board and resin layer, with the conductive layer partially disposed between the heat transfer member and resin layer, to cover voids and enhance adhesion, thereby suppressing partial discharge and maintaining high insulation properties.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a multilayer resin sheet is attached to a plate surface with large irregularities and different potentials, then heat dissipation is achieved, but voids form between the board and resin sheet causing insulation deterioration

Engineering Contradiction:

Improveheat dissipationVSAvoidinsulation properties

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

A conductive layer is introduced as an intermediary between the board and the resin layer. This conductive layer fills voids formed by board irregularities and eliminates potential differences, preventing partial discharge while maintaining thermal conduction pathways for effective heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The structure combines multiple materials with different properties: a board, a resin layer for insulation and heat dissipation, and a conductive layer for electrical continuity. This composite structure simultaneously achieves thermal management and electrical insulation by leveraging the complementary properties of each material.

Inventive Principle:

Principle #40Composite materials

2Temperature

If a multilayer resin sheet is used for heat dissipation, then thermal management is improved, but void formation occurs due to surface irregularities

Engineering Contradiction:

Improveheat dissipationVSAvoidvoid formation

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The conductive layer serves as a mediator that compensates for surface irregularities. It conforms to the board's uneven surface and eliminates gaps, ensuring complete contact between the board and resin layer without requiring high manufacturing precision.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The conductive layer changes the physical parameters of the interface between board and resin. By introducing a material with different flow and conformability characteristics, the system accommodates surface irregularities and eliminates voids that would otherwise form due to manufacturing tolerances.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If voids are formed between board and resin sheet, then assembly is simplified, but partial discharge occurs due to insulation deterioration

Engineering Contradiction:

Improveassembly simplicityVSAvoidpartial discharge

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The conductive layer acts as a protective intermediary that eliminates the harmful effect of voids. It provides a continuous conductive path that prevents partial discharge in void regions while maintaining the simple assembly process of stacking the multilayer structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The conductive layer converts the potentially harmful void spaces into beneficial conductive pathways. Instead of leaving voids as insulation weaknesses, the conductive material fills these spaces and transforms them into regions that actively prevent partial discharge and enhance electrical reliability.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The configuration ensures high insulation properties by covering voids with the conductive layer, preventing partial discharge and enhancing adhesion, resulting in an effective heat-dissipating structure.

Implementation Method 1

a conductive layer provided between the board and the resin layer and across the board and the heat transfer member, the conductive layer being partially disposed between the heat transfer member and the resin layer

Methodology Applied

Scientific EffectElectrical Conduction: Conduction (electrical)

Implementation Method 2

at least one heat transfer portion configured to transfer heat generated by the heating element to the heat dissipation member through the resin layer

Methodology Applied

Scientific EffectThermal Conduction: Conduction (thermal)

Data Source

PatentUS12446193B2Heat-dissipating structure

Publication Date: 2025.10.14 OMRON CORP

AI summary

A heat-dissipating structure includes a board configured to be attached to a heating element, a resin layer provided between the board and a heat dissipation member, the resin layer being attached to the board, and at least one heat transfer portion configured to transfer heat generated by the heating element to the heat dissipation member through the resin layer. The at least one heat transfer portion includes a heat transfer member, which is plate-shaped, provided between the board and the resin layer, the heat transfer member extending along the board, and a conductive layer provided between the board and the resin layer and across the board and the heat transfer member, the conductive layer being partially disposed between the heat transfer member and the resin layer.