Heat Dissipation Assembly to Prevent Adhesive Sheet Dislodgment
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Solution Overview
Problem
Existing heat dissipation mechanisms for electronic components face challenges with poor attachment of heat dissipation sheets to heat-conductive adhesive sheets, leading to ineffective heat dissipation due to potential dislodgment of the adhesive sheets.
Innovation Solution
A heat dissipation mechanism comprising a carrier assembly, a heat dissipation assembly with inclined extruded sheets, and a buckle assembly with resist members that ensure proper contact and attachment between the heat dissipation assembly and the heat-conductive adhesive sheet, preventing dislodgment and enhancing heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a heat dissipation sheet is inserted into the electronic component and tightly attached to the heat-conductive adhesive sheet, then heat dissipation performance should be improved, but the heat-conductive adhesive sheet may be pushed off by the heat dissipation sheet, resulting in poor attachment and reduced heat dissipation effectiveness
Solution Approach 1:
The heat dissipation sheet is pre-attached to the heat-conductive adhesive sheet before insertion into the electronic component. This preliminary attachment ensures that the adhesive sheet is already secured in place, preventing it from being pushed off during the insertion process and maintaining stable attachment throughout operation
Solution Approach 2:
The heat dissipation system is divided into separate functional components: the heat dissipation sheet, the heat-conductive adhesive sheet, and the electronic component. This segmentation allows each component to be optimized independently and assembled in a controlled sequence, ensuring proper attachment and heat dissipation performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The mechanism effectively prevents the dislodgment of heat-conductive adhesive sheets, ensuring stable and efficient heat dissipation from electronic components, thereby maintaining optimal device performance.
Implementation Method 1
a heat-conductive adhesive sheet is attached to the electronic component, a heat dissipation sheet is inserted into the electronic component and tightly attached to the heat-conductive adhesive sheet, the heat-conductive adhesive sheet and the heat dissipation sheet can dissipate heat from the electronic component
Data Source
AI summary
A heat dissipation mechanism comprises a carrier assembly, a heat dissipation assembly, and a buckle assembly, the carrier assembly comprises a base configured for assembling an electronic component with a heat-conductive adhesive sheet attached; the heat dissipation assembly comprises a top plate and a crimping unit, the top plate defines a penetration hole, the crimping unit comprises an extruded sheet, the extruded sheet is located on the side of the heat-conductive adhesive sheet away from the electronic component, the side of the extruded sheet away from the heat-conductive adhesive sheet has a protrusion provided thereon; the buckle assembly comprises a cover plate and a cladding unit, the cladding unit comprises a resist member, the side of the resist member which facing the extruded sheet has a stop portion provided thereon. An electronic device is also provided, which comprising the provided heat dissipation mechanism, an electronic component, and a case.