Heat Dissipation Structure With Adjustment Channel for Liquid Metal TIM
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Solution Overview
Problem
Conventional semiconductor packages face issues with heat dissipation due to the use of liquid metal thermal interface materials (TIMs) that expand and overflow at high temperatures, causing contamination of other components.
Innovation Solution
A heat dissipation structure with an adjustment channel that includes a fluid section and a gas section, where the fluid section communicates with the carrying area to adjust the volume of the first heat dissipation material, and the gas section communicates with the outside to discharge excess gas, preventing overflow and contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If liquid metal is used as thermal interface material to improve heat dissipation efficiency, then heat dissipation performance is improved, but the liquid metal expands and overflows at high temperatures causing contamination of other components
Solution Approach 1:
A gas barrier layer is introduced as an intermediary between the liquid metal thermal interface material and the surrounding environment. This gas barrier layer acts as a mediator that allows thermal contact while preventing the liquid metal from overflowing and contaminating other components, thus resolving the contradiction between heat dissipation efficiency and contamination prevention
Solution Approach 2:
A flexible encapsulant structure is employed to contain the liquid metal thermal interface material. The encapsulant provides a flexible barrier that accommodates thermal expansion of the liquid metal while preventing it from overflowing outside the semiconductor device, thereby maintaining both effective heat dissipation and preventing contamination
2Loss of energy
If liquid metal thermal interface material is used to replace traditional hard material TIM, then heat dissipation capability is improved, but stability of the TIM layer at high temperatures deteriorates
Solution Approach 1:
The liquid metal thermal interface material is enclosed within a flexible encapsulant structure that maintains the stability of the TIM layer at high temperatures. The encapsulant provides structural support and containment while allowing thermal energy to pass through, thus improving both heat dissipation capability and thermal stability
Solution Approach 2:
A composite structure is formed by combining the liquid metal thermal interface material with the encapsulant material. This composite structure leverages the high thermal conductivity of liquid metal while the encapsulant provides thermal stability and structural integrity at elevated temperatures, resolving the contradiction between heat dissipation capability and thermal stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively stabilizes the heat dissipation material at high temperatures, preventing overflow and contamination, while maintaining efficient heat dissipation through the use of a tapered fluid section and gas section design.
Implementation Method 1
because the TIM layer 12 is a liquid metal, it is a fluid and expands at high temperatures
Implementation Method 2
the heat generated by the semiconductor chip 11 is conducted to the top sheet 130 of the heat dissipation element 13 via the inactive surface 11b and the TIM layer 12 to dissipate heat to the outside of the semiconductor package 1
Data Source
AI summary
A heat dissipation structure is provided and includes a heat dissipation body and an adjustment channel. A carrying area and an active area adjacent to the carrying area are defined on a surface of the heat dissipation body, the carrying area is used for applying a first heat dissipation material thereonto, and the adjustment channel is formed in the active area, where one end of the adjustment channel communicates with the outside of the heat dissipation structure, and the other end communicates with the carrying area. Therefore, when the heat dissipation body is coupled to the electronic component by the first heat dissipation material, the adjustment channel can adjust a volume of the first heat dissipation material.