Heat Dissipation Device with Air Deflectors for Electronic Cooling

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Solution Overview

Problem

Existing heat dissipation devices for electronic devices face challenges in effectively discharging heated air outside due to blockage by the housing, leading to re-circulation and increased internal temperatures.

Innovation Solution

The heat dissipation device incorporates a second heat dissipation fin with air deflectors that form an air passage with a narrower outlet than the housing opening, ensuring the air is not blocked and can be directly discharged outside, utilizing a heat pipe to transfer heat from the heat-generating element to the fins and a fan to drive airflow through this passage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the housing opening is made larger to discharge heated air, then the discharge efficiency is improved, but the risk of heated air being blocked and re-circulated increases

Engineering Contradiction:

Improveheat discharge efficiencyVSAvoidairflow stability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The opening is segmented into multiple air passages by dividing it with ribs, creating multiple discrete flow paths. This segmentation allows the air flow to be organized into controlled channels, preventing random circulation while maintaining high discharge efficiency through increased total opening area.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the opening are given different functions: some regions serve as air intake areas while others serve as exhaust areas. The air passages are strategically positioned to create localized flow patterns that direct heated air outward while preventing it from being drawn back into the housing.

Inventive Principle:

Principle #3Local quality

2Temperature

If heat dissipation fins are added to increase heat transfer area, then the heat dissipation effect is improved, but the device complexity increases

Engineering Contradiction:

Improveheat dissipation effectVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The air deflectors are merged with the heat dissipation fin structure, combining the airflow guidance function with the heat dissipation function into a single integrated component. This reduces the number of separate parts while achieving both heat dissipation and airflow control objectives.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The air deflectors serve multiple functions simultaneously: they guide airflow through the opening, prevent heated air from being drawn back into the housing, and work in conjunction with the heat dissipation fins to enhance cooling efficiency. This multi-functionality reduces overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Productivity

If air deflectors are positioned closer together to form narrower air passages, then the discharge efficiency is improved, but the airflow resistance increases

Engineering Contradiction:

Improveair discharge efficiencyVSAvoidairflow resistance

Core Design Contradiction:

ProductivityVSForce

Solution Approach 1:

The air passages are arranged in multiple dimensions rather than a single plane, with vertical and horizontal components. This dimensional arrangement allows the air flow to navigate through the structure more efficiently, reducing resistance while maintaining effective discharge through the narrowed passages.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration prevents re-circulation of heated air, effectively reducing internal temperatures by ensuring that hot air is discharged outside, thereby enhancing the cooling efficiency of electronic devices.

Implementation Method 1

The heat pipe is in contact with the heat-generating element, the first heat dissipation fin, and the second heat dissipation fin

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

The fan is disposed in the accommodation space and located at the air intake end of the air passage for driving an air flow passing through the air passage and discharged via the opening

Methodology Applied

Scientific EffectForced convection: Forced Convection

Implementation Method 3

The heat dissipation fin quickly dissipates the heat of the electronic components to the air inside the electronic device

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 4

The cold air after entering the electronic device exchanges heat with the electronic components inside the electronic device

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS8644023B2Heat dissipation device and electronic device using the same

Publication Date: 2014.02.04 INVENTEC CORP

AI summary

A heat dissipation device is disposed in an electronic device. The electronic device has an opening and an upper wall and a lower wall at the position where the opening is formed. The heat dissipation device includes an air passage and a pair of air deflectors disposed on two opposite sides of the air passage. A distance between the pair of air deflectors is smaller than a distance between the upper wall and the lower wall. The pair of air deflectors is located between the upper wall and the lower wall. The hot air inside the electronic device after passing through the air passage will not be obstructed by a barrier but is directly discharged outside the electronic device through the opening.