Heat Dissipation Component Layout for Airflow and Heat Transfer
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Solution Overview
Problem
Conventional electronic devices face challenges in effectively dissipating heat generated by electronic components, necessitating improved heat dissipation solutions.
Innovation Solution
The electronic device incorporates a heat dissipation component with a support segment and non-parallel extension pieces that facilitate heat conduction and airflow, featuring a design that allows for efficient heat transfer and airflow paths through the use of extension pieces and connection segments, which are manufactured from materials like aluminum or copper, and can be integrated with a cooling assembly for enhanced cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heat dissipation structures are used, then the device structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation component is divided into multiple extension pieces (first extension piece, second extension piece, etc.) connected to the support segment, with each extension piece having a specific function and orientation. This segmentation increases the heat dissipation surface area and improves heat dissipation efficiency while maintaining structural organization through modular design.
Solution Approach 2:
The extension pieces are arranged in different directions and orientations relative to the support segment, utilizing three-dimensional space to increase the heat dissipation surface area. The first extension piece extends in one direction while the second extension piece extends in a different direction, creating a multi-dimensional heat dissipation structure that improves thermal performance without significantly increasing the footprint area.
2Productivity
If extension pieces are added to increase heat dissipation area, then heat dissipation efficiency improves, but manufacturing complexity increases
Solution Approach 1:
Multiple extension pieces are integrated into a single heat dissipation component that can be manufactured as one piece or assembled from pre-fabricated sections. The connection structures between extension pieces and the support segment are designed to facilitate easy assembly, reducing manufacturing complexity while maintaining the increased heat dissipation surface area provided by multiple extension pieces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation efficiency by increasing contact area and optimizing airflow paths, resulting in improved cooling performance for electronic components.
Implementation Method 1
The operation of electronic component inevitably generates heat. Therefore, how to dissipate heat is one of the goals of industry players in this technical field.
Data Source
AI summary
An electronic device includes a circuit board, a heat dissipation component and an electronic component. The heat dissipation component is disposed on the circuit board and includes a support segment and an extension segment. The extension segment is connected to the support segment. The electronic component is disposed in the support segment. The extension segment and the support segment are not parallel.