Heat Dissipation Assembly Partition Structure for Multi-Source Cooling

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Solution Overview

Problem

Current water-cooled heat dissipation assemblies are limited by space constraints and can only effectively dissipate heat for a single heat source, which restricts their ability to manage high-power consuming components in high-speed computing environments.

Innovation Solution

A heat dissipation assembly that utilizes a partition structure to create multiple flow paths within a case, allowing cooling fluid to flow through upper and lower paths from one side to the other, enabling efficient heat dissipation from multiple heat sources on a mainboard, such as a central processor and a southbridge chip, by leveraging pressure differences to facilitate fluid circulation and heat exchange.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a water-cooled heat dissipation assembly is used, then heat dissipation effectiveness is improved, but the device can only dissipate heat for a single heat source due to space constraints

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidnumber of heat sources

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The internal cavity of the heat dissipation assembly is divided into multiple independent flow paths using partition walls. Each flow path is dedicated to cooling a specific heat source, allowing the single heat dissipation assembly to simultaneously cool multiple heat sources on the mainboard without compromising cooling effectiveness for each individual component.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If the heat dissipation assembly is designed to accommodate multiple heat sources, then adaptability is improved, but the structural complexity increases

Engineering Contradiction:

Improvenumber of heat sourcesVSAvoidstructural complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The heat dissipation assembly uses partition walls to divide the internal cavity into multiple flow paths, enabling multi heat source cooling while maintaining a relatively simple overall structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat dissipation assembly is designed with a universal structure that can accommodate multiple heat sources through its multi-flow path configuration. The assembly serves multiple functions by cooling different heat sources simultaneously, reducing the need for separate cooling devices for each component.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Temperature

If cooling fluid flows through multiple paths, then heat dissipation capability is improved, but fluid flow control becomes more difficult

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidfluid flow control

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The internal cavity is segmented into multiple independent flow paths using partition walls, with each path having defined inlet and outlet ports. This segmentation allows cooling fluid to flow through multiple paths simultaneously while maintaining controlled and predictable flow distribution to different heat sources.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The partition walls act as intermediaries that guide and control the flow of cooling fluid through different paths. Each partition wall with its designated inlet and outlet ports serves as a flow control element, ensuring proper fluid distribution across multiple heat sources without requiring complex external control mechanisms.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enhances the heat dissipation capability of electronic devices by effectively managing heat from multiple sources, improving operational fluency and reducing temperature-related issues in high-performance computing systems.

Implementation Method 1

The heat dissipation assembly mainly absorbs the heat energy of the heat source (such as a central processor, or a display chip of a mainboard), and then discharges the heat-absorbing liquid for heat exchange cooling

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

discharges the heat-absorbing liquid for heat exchange cooling, and dissipates heat via this cycle

Methodology Applied

Scientific EffectHeat exchange: Heat Exchanger

Implementation Method 3

leveraging pressure differences to facilitate fluid circulation and heat exchange

Methodology Applied

Scientific EffectPressure difference: Pressure Gradient

Data Source

PatentEP3644159B1Heat dissipation assembly and mainboard module

Publication Date: 2022.01.12 GIGA BYTE TECH CO LTD

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AI summary

A heat dissipation assembly includes a case and a partition structure. The case includes a cavity, a first water hole, and a second water hole, wherein the cavity includes a first region and a second region communicated with each other. The first water hole and the second water hole are communicated with the first region. The partition structure includes a separation wall and a separation layer connected to each other, wherein the separation wall is vertically disposed in the first region to separate a first flow path and a second flow path disposed in left and right portions in the first region. The separation layer is horizontally disposed in the second region to separate a third flow path and a fourth flow path disposed in upper and lower portions in the second region.