Heat Dissipation Structure With Buffer Grooves for Screen Protection
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Solution Overview
Problem
Electronic devices such as mobile phones and tablets experience severe localized heating due to inadequate heat dissipation, leading to performance degradation, shortened service life, and screen damage.
Innovation Solution
A heat dissipation structure comprising a first and second cover plate connected to form a receptacle with a liquid-absorbing structure and vapor channel, featuring buffer grooves and sealing layers for elastic deformation, which dissipates heat effectively and provides buffering and supporting functions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation structure is added to the electronic device, then heat dissipation performance is improved, but device weight increases
Solution Approach 1:
The patent employs phase change material (paraffin) that transitions between solid and liquid states to absorb and dissipate heat. The vaporization channel enables the working fluid to undergo phase transitions, absorbing heat during vaporization and releasing it during condensation, thereby achieving efficient heat dissipation while maintaining a lightweight structure compared to traditional metal heat sinks.
Solution Approach 2:
The heat dissipation structure combines multiple materials with different properties: the cover plate uses aluminum alloy for thermal conductivity and lightweight characteristics, the sealing layer uses rubber for elasticity and sealing, and the phase change material (paraffin) provides heat absorption capacity. This composite approach achieves optimal heat dissipation performance while controlling overall weight.
2Strength
If the first cover plate is made rigid for structural support, then mechanical strength is improved, but flexibility and stress absorption deteriorate
Solution Approach 1:
The first cover plate incorporates a rubber sealing layer that provides flexibility and elastic deformation capability. This flexible layer can absorb stress and adapt to dimensional changes while maintaining the overall structural integrity, resolving the contradiction between rigidity for support and flexibility for stress absorption.
Solution Approach 2:
The cover plate is constructed as a composite structure combining aluminum alloy (for strength and thermal conductivity) with rubber sealing layers (for flexibility and stress absorption). This multi-material construction allows the cover plate to simultaneously achieve mechanical strength for structural support and flexibility for stress absorption and adaptation.
3Adaptability or versatility
If buffer grooves are added to the first cover plate for stress absorption, then flexibility is improved, but manufacturing complexity increases
Solution Approach 1:
The buffer grooves create a porous-like structure within the cover plate that provides stress absorption and flexibility. These grooves allow the material to deform elastically under stress while maintaining structural integrity, achieving buffering functions without requiring complex additional components.
Solution Approach 2:
The first cover plate is segmented into multiple regions by the buffer grooves, creating zones of varying stiffness. This segmentation allows different parts of the cover plate to deform differently under stress, improving overall flexibility and stress distribution while being manufacturable through standard molding processes.
4Reliability
If multiple sealing layers are added to protect the phase change material, then reliability is improved, but device complexity increases
Solution Approach 1:
The rubber sealing layers serve as flexible membranes that encapsulate and protect the phase change material. These thin film-like sealing layers provide effective protection against leakage while adding minimal structural complexity, as they can be integrated into the cover plate manufacturing process.
Solution Approach 2:
The sealing structure uses composite materials combining rubber (for elasticity and sealing) with the aluminum alloy cover plate. This integration protects the phase change material effectively while maintaining a relatively simple overall structure that can be manufactured as an integrated component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure promptly dissipates heat, preventing localized overheating, protecting the screen from damage, and achieving a lightweight design while enhancing the device's reliability and performance.
Implementation Method 1
a liquid-absorbing structure... A vapor channel is further provided in the receptacle
Implementation Method 2
the liquid-absorbing structure extends from the first area to the second area. A vapor channel is further provided in the receptacle, and the vapor channel extends from the second area to the first area
Implementation Method 3
positions that are in the first material layer and that correspond to the buffer grooves include elastic deformation
Data Source
AI summary
A heat dissipation structure includes a first cover plate, a second cover plate, and a liquid-absorbing structure. The first cover plate and the second cover plate are connected to each other to form a receptacle. The liquid-absorbing structure is located in the receptacle. The first cover plate includes a first sealing layer, a first material layer, and a second sealing layer; the first material layer is located between the first sealing layer and the second sealing layer; the first cover plate has a plurality of buffer grooves spaced apart; and positions that are in the first material layer and that correspond to the buffer grooves are elastically deformed.