Heat Dissipation Apparatus With Buffer Member For Processor Cooling
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Solution Overview
Problem
The accumulation of excessive heat in electronic devices negatively impacts processing speed and service life due to increased functionalities and heat generation during operation.
Innovation Solution
A heat dissipation apparatus with a housing, inlet, outlet, heat dissipating member, and buffer member with through-holes, which introduces and circulates a cooling fluid to transfer heat efficiently from the processor, utilizing thermally conductive materials and optimized flow paths to enhance heat conduction and convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cooling liquid flows directly from inlet to heat dissipating member, then heat dissipation efficiency is improved, but flow control and thermal management become difficult
Solution Approach 1:
The buffer member acts as an intermediary component between the inlet and heat dissipating member. It receives cooling liquid from the inlet and controllably releases it to the heat dissipating member through multiple through-holes, enabling flow control and thermal management while maintaining effective heat dissipation.
Solution Approach 2:
The cooling flow path is segmented into multiple stages: inlet → buffer member → through-holes → heat dissipating member. This segmentation allows independent optimization of each stage, with the buffer member controlling flow distribution to achieve both effective cooling and manageable complexity.
2Adaptability or versatility
If more functionalities are integrated in electronic devices, then device capabilities are improved, but heat generation increases
Solution Approach 1:
The buffer member serves as a thermal management intermediary that decouples heat generation from device functionalities. It provides controlled thermal processing of cooling liquid, enabling effective heat removal from high-performance components without limiting device capability integration.
3Reliability
If buffer member with through-holes is added, then flow control and heat transfer are improved, but device complexity increases
Solution Approach 1:
The buffer member performs multiple functions simultaneously: it controls cooling liquid flow distribution, enhances heat transfer through the through-holes structure, and provides thermal management. This multi-functionality improves reliability without requiring additional separate components, thereby limiting complexity increase.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively dissipates heat from the processor, improving processing performance by increasing heat conduction efficiency and reducing thermal impact on the electronic device, thereby enhancing operational speed and longevity.
Implementation Method 1
transfer heat efficiently from the processor, utilizing thermally conductive materials and optimized flow paths to enhance heat conduction and convection
Implementation Method 2
transfer heat efficiently from the processor, utilizing thermally conductive materials and optimized flow paths to enhance heat conduction and convection
Data Source
AI summary
Disclosed is a heat dissipation apparatus and an electronic device. The heat dissipation apparatus is suitable for a processor in an electronic device. The heat dissipation apparatus includes a housing including an inlet for introducing a cooling fluid into the housing and an outlet for allowing the cooling fluid to exit from the housing. The heat dissipation apparatus includes a heat dissipating member disposed in the housing. The heat dissipation apparatus includes a buffer member disposed between the inlet and the heat dissipating member. The buffer member includes through-holes for inhibiting a flow of the cooling liquid from the inlet of the housing to the dissipating member to transfer heat across the heat dissipating member to the cooling fluid. The electronic device may include a processor and the heat dissipation apparatus.