Heat Dissipation Module With Buffer Member For SSD Thermal Adherence
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Solution Overview
Problem
Conventional heat dissipation methods for solid-state drives (SSDs) often fail to achieve uniform temperature distribution due to inadequate thermal adherence of metal foils to the housing, leading to limited cooling efficiency.
Innovation Solution
A heat dissipation module is designed with a buffer member between a heat conductive plate and a housing, allowing reliable thermal adherence and enhanced heat dissipation through increased contact area, achieved by using a buffer member that is pressed and deformed to push the heat conductive plate against the housing, thereby improving thermal conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a metal foil is used to conduct heat from the SSD to the housing, then heat dissipation is attempted, but the metal foil is not reliably thermally adhered to the housing, resulting in heat accumulation and limited cooling effect
Solution Approach 1:
A buffer member is introduced as an intermediary component between the heat conductive plate and the housing. This buffer member ensures reliable thermal adherence by filling gaps and maintaining consistent contact pressure, thereby resolving the issue of heat accumulation caused by unreliable thermal adherence.
2Loss of energy
If the heat conductive plate is directly adhered to the housing, then the structure is simple, but the contact area is insufficient, limiting heat dissipation effectiveness
Solution Approach 1:
The buffer member serves as an intermediary that increases the effective contact area between the heat conductive plate and the housing. By compressing the buffer member, the heat conductive plate achieves broader and more reliable thermal contact with the housing, enhancing heat dissipation without significantly complicating the overall structure.
3Reliability
If the heat conductive plate is rigidly fixed, then installation is simple, but thermal contact is unreliable due to surface irregularities, reducing heat dissipation performance
Solution Approach 1:
The buffer member changes the mechanical parameters of the assembly by providing compliance and elasticity. When compressed, the buffer member deforms to conform to surface irregularities, ensuring reliable thermal contact between the heat conductive plate and the housing while maintaining installation simplicity.
Solution Approach 2:
The buffer member provides beforehand cushioning by pre-compressing the heat conductive plate against the housing with consistent force. This ensures reliable thermal contact is achieved from the beginning of operation, compensating for any surface irregularities or assembly variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases the thermal contact area, leading to enhanced heat dissipation efficiency by ensuring reliable thermal adherence and efficient heat transfer from the SSD to the housing.
Implementation Method 1
The deformed buffer member produces an elastic restoring force, so as to provide a forward force for pushing the heat conductive plate towards the housing
Implementation Method 2
the buffer member is clamped between the sub-circuit board and the housing and becomes pressed and deformed. The deformed buffer member produces an elastic restoring force, so as to provide a forward force for pushing the heat conductive plate towards the housing, and the heat conductive plate is allowed to be reliably thermally adhered to the housing through the buffer member, thereby increasing a contact area for thermal conduction
Data Source
AI summary
The present invention relates to a heat dissipation module and an assembly method thereof. The heat dissipation module includes a heat conductive plate and a buffer member. The heat conductive plate includes a cover section and a first extension section. The cover section covers a heat zone. The buffer member is provided at the heat conductive plate to interferingly match with a housing, so as to conduct heat energy produced by the heat zone to the housing. Accordingly, by configuring the buffer member between the heat conductive plate and the housing, the heat conductive plate is allowed to be reliably thermally adhered to the housing, thereby achieving enhanced heat dissipation efficiency for the heat dissipation module.