Heat Dissipation Module With Buffer Member For Constant Pressure

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Solution Overview

Problem

Existing immersion type heat dissipation devices for CPUs face inefficiency due to increased boiling point caused by pressure changes during vaporization, requiring large spaces and preventing modular design.

Innovation Solution

A heat dissipation module with a buffer member connected to the containing portion, which expands to maintain constant pressure, mitigating the boiling point increase and enhancing heat dissipation efficiency by using a working fluid with a low boiling point and high specific heat, such as water, and incorporating a heat transfer member with a hydrophilic surface.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If immersion type heat dissipation devices are used to dissipate heat through vaporization, then heat dissipation capability is improved, but pressure increases causing boiling point increase which reduces heat dissipation efficiency

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidheat dissipation efficiency

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The device is divided into a sealed heat dissipation chamber and an expansion chamber separated by a movable partition. This segmentation allows the vaporization process to occur in the sealed chamber while the expansion chamber accommodates pressure changes, preventing boiling point increase and maintaining heat dissipation efficiency.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The movable partition acts as an intermediary between the sealed heat dissipation chamber and the expansion chamber. It transmits pressure changes while maintaining separation, allowing the system to handle pressure increases during vaporization without compromising the boiling point of the working fluid in the heat dissipation chamber.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If large space is provided to solve pressure change problems during vaporization, then heat dissipation efficiency is maintained, but device size increases preventing modular design

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddevice size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The expansion chamber is nested within or adjacent to the sealed heat dissipation chamber, with the movable partition creating a compact integrated structure. This nesting arrangement allows the system to maintain constant pressure during vaporization without requiring a large external volume, enabling modular design while preserving heat dissipation efficiency.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Productivity

If pressure is allowed to increase during vaporization, then heat dissipation capability is enhanced, but boiling point increases rapidly reducing heat dissipation effectiveness

Engineering Contradiction:

Improveheat dissipation capabilityVSAvoidboiling point

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The movable partition dynamically adjusts its position in response to pressure changes during vaporization. As pressure increases in the sealed chamber, the partition moves to accommodate the expanding vapor in the expansion chamber, maintaining constant pressure and preventing boiling point increase, thus preserving heat dissipation effectiveness.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution maintains constant pressure within the heat dissipation module, increasing its efficiency and reliability, achieving heat dissipation ten times higher than forced convection, while allowing for a compact modular design.

Implementation Method 1

the immersion type heat dissipation devices dissipate heat by utilizing the principle that a great deal of heat can be absorbed by vaporizing liquid

Methodology Applied

Scientific EffectVaporization: Evaporation

Implementation Method 2

When the working fluid is heated, the buffer part is expanded to maintain a constant pressure within the containing portion

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS11232997B2Heat dissipation module and electronic device

Publication Date: 2022.01.25 WISTRON CORP

AI summary

A heat dissipation module including a heat dissipation portion, a working fluid, and a buffer member is provided. The heat dissipation portion has a containing portion, the working fluid is contained in the containing portion, and the buffer member is connected to the containing portion. When the working fluid is heated, the buffer member is expanded to maintain a constant pressure within the containing portion.