High Heat-Dissipation Circuit Board Assembly System
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Solution Overview
Problem
Conventional low-voltage high-current power supplies face challenges in heat dissipation due to insufficient copper-clad area, leading to heat accumulation and reduced voltage output efficiency, especially with tin-plated copper foil and electronic components generating heat during operation.
Innovation Solution
A high heat-dissipation circuit board assembly system comprising a circuit board with a substrate, a transformer, and racks made from electrically conductive materials, where the racks are connected to the transformer and substrate to enhance heat conductivity and distribution, allowing for effective dissipation of heat produced by both the transformer and electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large copper-clad area is provided on the circuit board to dissipate heat from high current, then heat dissipation capability is improved, but the circuit board size and material cost increase
Solution Approach 1:
The invention transitions from two-dimensional heat dissipation on the circuit board surface to three-dimensional heat dissipation by extending heat dissipation fins vertically from the circuit board. This adds a vertical dimension (Z-axis) to the heat dissipation structure, allowing heat to be dissipated through both the circuit board surface and the extended fin surfaces, effectively increasing the heat dissipation area without proportionally increasing the circuit board footprint.
Solution Approach 2:
The invention uses a composite structure combining the circuit board substrate with integrated heat dissipation fins made of thermally conductive materials. The circuit board itself serves as a heat conduction path, while the attached fins provide additional heat dissipation surfaces. This composite approach allows efficient heat transfer from the high-current traces through the board material to the extended fin surfaces.
2Ease of manufacture
If tin-plated copper foil with standard thickness is used, then manufacturing is simplified, but lateral area is insufficient for high current flow leading to heat accumulation
Solution Approach 1:
Instead of increasing the lateral area of the copper foil in the plane of the circuit board, the invention extends the heat dissipation structure vertically by adding heat dissipation fins. This dimensional transition allows the same copper foil to dissipate heat through its connected fin surfaces, effectively increasing the heat dissipation area without requiring thicker or wider copper traces on the board itself.
3Device complexity
If electronic components are installed on the back surface of the circuit board, then component integration is improved, but heat from components affects component operation
Solution Approach 1:
The invention extracts the heat dissipation function from the circuit board surface and separates it into dedicated heat dissipation fins. These fins are positioned to receive heat from both the high-current traces and the electronic components on the back surface, acting as a thermal sink that protects components from excessive heat while maintaining their integrated installation on the board.
Solution Approach 2:
The heat dissipation fins serve as an intermediary thermal management structure between the heat-generating components and the surrounding environment. The fins are thermally coupled to the circuit board and components, absorbing excess heat and dissipating it through their extended surfaces, thereby protecting components from thermal damage while allowing them to remain mounted on the board.
4Device complexity
If conventional circuit board design is used, then design simplicity is maintained, but voltage output efficiency decreases due to temperature rise
Solution Approach 1:
The invention maintains the simplicity of conventional circuit board design for the electrical circuitry while adding vertical heat dissipation fins. This dimensional addition provides effective heat management without complicating the electrical design, ensuring that voltage output efficiency is maintained by preventing temperature-induced impedance increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively conducts and dissipates heat, improving the power supply's efficiency and preventing heat accumulation, while also miniaturizing the power supply and reducing material costs by altering the current flow path and using high thermal conductivity materials.
Implementation Method 1
heat produced by the transformer and the electronic components may be more effectively conducted and dissipated
Implementation Method 2
heat produced after the high current flows therethrough
Data Source
AI summary
The disclosure provides a power supply including a high heat-dissipation circuit board assembly system in which a rack is installed on a circuit board so as to be connected to a transformer. Heat produced when electronic components installed on the circuit board are actuated may be conducted and dissipated thereby. The efficiency and the heat conductivity effect of the power supply may be further enhanced by distributing the amount and the flowing direction of the current from the transformer.