Heat Dissipation Structure With Composite Housing And Metal Layer
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Solution Overview
Problem
Electronic apparatuses with plastic housings need to balance efficient heat dissipation with waterproofing, as metal housings with high thermal conductivity do not meet both requirements.
Innovation Solution
A heat dissipation structure featuring a high thermal resistance housing with a thermal pad and metal bracket, where a metal layer is arranged outside a columnar space within the housing, and a fastening member secures the metal bracket to enhance heat exchange while maintaining a sealed environment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal housing with high thermal conductivity is used, then heat dissipation efficiency is improved, but waterproof performance deteriorates due to the need for vents
Solution Approach 1:
The patent employs a composite structure combining a plastic housing (providing waterproof sealing) with an integrated metal layer (providing thermal conduction). This composite design allows the housing to maintain waterproof integrity while achieving efficient heat dissipation through the metal pathway, eliminating the need for vents that would compromise sealing.
Solution Approach 2:
The invention transitions from traditional planar heat dissipation surfaces to a three-dimensional integrated metal layer structure within the housing wall. This dimensional transformation creates internal thermal conduction pathways that do not require external vents, enabling heat dissipation without compromising the waterproof seal.
2Reliability
If a plastic housing with high thermal resistance is used, then waterproof performance is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent employs a composite structure combining a plastic housing (providing waterproof sealing) with an integrated metal layer (providing thermal conduction). This composite design allows the housing to maintain waterproof integrity while achieving efficient heat dissipation through the metal pathway, eliminating the need for vents that would compromise sealing.
3Temperature
If vents are provided on the housing to facilitate heat dissipation, then heat dissipation efficiency is improved, but waterproof performance deteriorates
Solution Approach 1:
The invention extracts the thermal conduction function from the housing wall material selection and implements it through a separate metal layer. This separation allows the main housing to remain fully sealed while the metal layer provides dedicated heat dissipation pathways, eliminating the need for compromising vents.
Solution Approach 2:
The metal layer acts as an intermediary element between the internal heat sources and the external environment. It provides a thermal conduction pathway that does not require breaking the waterproof seal, serving as a mediator that enables heat dissipation without compromising sealing integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively dissipates heat while ensuring the electronic apparatus remains waterproof, addressing the need for efficient heat management without compromising sealing.
Implementation Method 1
The thermal pad conducts heat exchange with the metal layer and the electronic component
Implementation Method 2
a fastening member penetrates through the metal bracket and is inserted into the columnar space through the first end to urge the metal bracket to be in contact with the metal layer
Data Source
AI summary
A heat dissipation structure and an electronic apparatus having the heat dissipation structure are provided. The electronic apparatus includes a printed circuit board, a high thermal-resisting housing, a thermal pad and a metal bracket. Heat is transferred between the thermal pad and an electronic component mounted on the printed circuit board. The high thermal-resisting housing defines an inner space for accommodating the printed circuit board. A columnar space is formed in the high thermal-resisting housing, and a metal layer is arranged outside the columnar space. The thermal conductivity of the high thermal-resisting housing is not greater than 1 W/m·K. The metal bracket and the printed circuit board are disposed at two opposite sides of the high thermal-resisting housing, respectively. A fastening member penetrates through the metal bracket and is inserted into the columnar space to urge the metal bracket to be in contact with the metal layer.