Heat Dissipation Structure With Convex Portions to Prevent Package Peeling
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Solution Overview
Problem
Conventional semiconductor packages face issues with peeling of the heat dissipation sheet due to small bonding areas, especially after the singulation process, leading to delamination from the corners of the heat dissipation sheet.
Innovation Solution
The electronic package design incorporates a heat dissipation structure with convex portions facing the carrier structure, which increases the bonding area with the cladding layer, preventing peeling and enhancing bonding strength, especially at the corners.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a whole-panel heat dissipation sheet is bonded to multiple semiconductor chips, then the heat dissipation effect is improved, but the bonding area between the heat dissipation sheet and the encapsulating compound is small (only local point-like bonding), causing peeling of the heat dissipation sheet especially after the singulation process
Solution Approach 1:
The patent introduces convex portions that extend upward from the heat dissipation sheet surface, transforming a two-dimensional bonding interface into a three-dimensional structure. This increases the bonding area between the heat dissipation sheet and the encapsulating compound, preventing peeling while maintaining effective heat dissipation across the entire panel.
2Ease of manufacture
If the heat dissipation sheet is bonded with small bonding area, then the manufacturing process is simple, but the bonding strength is insufficient and delamination occurs from the corners after singulation
Solution Approach 1:
By adding convex portions that protrude from the heat dissipation sheet, the patent creates additional bonding interfaces without complicating the manufacturing process. The convex portions are formed through straightforward molding or extrusion processes, while significantly enhancing the bonding strength between the heat dissipation sheet and encapsulating compound.
3Reliability
If convex portions are added to the heat dissipation structure, then the bonding area with the cladding layer is increased and peeling is prevented, but the device complexity increases
Solution Approach 1:
The convex portions add vertical dimension to the heat dissipation sheet, creating mechanical interlocking with the cladding layer. This simple geometric modification provides robust peeling prevention without requiring additional components, complex assembly steps, or sophisticated manufacturing processes.
Data Source
AI summary
An electronic package and a manufacturing method thereof are provided, in which an electronic element and a heat dissipation structure covering the electronic element are disposed on a carrier structure, and the electronic element is covered with a cladding layer. The heat dissipation structure has convex portions facing the carrier structure, so that the bonding area between the heat dissipation structure and the cladding layer is increased via the convex portions, thereby preventing the problem of peeling from occurring to the heat dissipation structure.