Heat Dissipation Member Composition Using Coupled Inorganic Fillers
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Solution Overview
Problem
Current heat dissipating members for electronic devices face challenges in achieving high thermal conductivity and controlling thermal expansion coefficients, which are crucial for efficient heat management and preventing thermal distortion in high-performance electronic components.
Innovation Solution
A composition that directly bonds inorganic fillers through coupling agents and bifunctional or higher reactive organic compounds, allowing for the formation of a heat dissipating member with enhanced thermal conductivity and controlled thermal expansion coefficients, utilizing materials like boron nitride and carbon-based fillers to improve phonon conduction and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If inorganic fillers are added to resin to increase thermal conductivity, then thermal conductivity is improved, but the thermal expansion coefficient cannot be controlled and processability deteriorates
Solution Approach 1:
The invention changes the parameter of thermal expansion coefficient by carefully selecting and combining different inorganic fillers (alumina with positive thermal expansion and boron nitride with negative thermal expansion) to achieve a net thermal expansion coefficient within the range of -50 to +50×10⁻⁶/K. This parameter control resolves the contradiction by enabling both high thermal conductivity and controlled thermal expansion, while the use of specific filler combinations maintains processability.
2Temperature
If inorganic fillers are added to resin to increase thermal conductivity, then thermal conductivity is improved, but crackability increases and reliability deteriorates
Solution Approach 1:
The invention uses a composite material approach by combining multiple inorganic fillers (alumina and boron nitride) with specific resin systems. This composite structure achieves high thermal conductivity while the controlled thermal expansion coefficient prevents differential expansion stresses that would cause cracking, thereby improving reliability. The synergistic combination of materials resolves the contradiction between thermal conductivity and crack resistance.
3Temperature
If aluminum nitride is used for heat dissipation, then thermal conductivity is improved, but processability and crackability worsen due to material brittleness
Solution Approach 1:
The invention embeds aluminum nitride particles within a resin matrix combined with other inorganic fillers, creating a composite material that maintains the high thermal conductivity of aluminum nitride while the resin and supporting inorganic fillers provide flexibility and crack resistance. This composite approach resolves the contradiction by preserving thermal performance while improving processability and reducing brittleness.
Solution Approach 2:
The invention changes the physical state and distribution parameters of aluminum nitride by dispersing it as particles within the composite matrix rather than using bulk material. This particle dispersion approach maintains thermal conductivity benefits while significantly improving processability and reducing crackability compared to solid aluminum nitride components.
4Temperature
If thermal expansion coefficients of package materials differ, then thermal conductivity may be improved, but thermal distortion occurs and reliability deteriorates
Solution Approach 1:
The invention directly addresses thermal distortion by controlling the thermal expansion coefficient parameter through filler selection and combination. By achieving a thermal expansion coefficient within -50 to +50×10⁻⁶/K, the invention minimizes differential expansion with semiconductor components, preventing warpage and detachment while maintaining high thermal conductivity through the same filler system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves extremely high thermal conductivity in both horizontal and thickness directions, along with controlled thermal expansion, providing excellent chemical stability, heat resistance, and mechanical strength, making it suitable for various heat dissipation applications such as substrates, sinks, and coatings.
Implementation Method 1
when inorganic materials are bonded to each other, that is, inorganic materials are directly bonded through a coupling agent and a bifunctional or higher reactive organic compound
Implementation Method 2
the thermal conductivity of the inorganic filler is a value specific to a substance and an upper limit thereof is fixed. Therefore, there have been many attempts regarding methods of improving thermal conductivity of a resin and thermal conductivity of a composite material from the bottom up
Data Source
Figure 1~3
Figure 4(a)~4(c)
Figure 4(d)~4(d')
AI summary
The present invention relates to a composition capable of forming a heat dissipating member having high thermal conductivity and a heat dissipating member. The composition for a heat dissipating member of the present invention is a composition for a heat dissipating member that includes a first inorganic filler having thermal conductivity that is bonded to one end of a coupling agent; a second inorganic filler having thermal conductivity that is bonded to one end of a coupling agent, in which a bifunctional or higher polymerizable compound is additionally bonded to the other end of the bonded coupling agent; wherein the other end of the coupling agent bonded to the first inorganic filler is to be bonded to the polymerizable compound on the second inorganic filler during curing.