Heat dissipation device
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Solution Overview
Problem
In heat dissipation systems, the limited inner space restricts the size of the fan, leading to increased airflow resistance and decreased heat dissipation efficiency when trying to enhance fan size, as the airflow channel between the fan and housing narrows.
Innovation Solution
A heat dissipation device with a movable fan module that changes positions within the enclosure, allowing a larger fan size without the need for an airflow channel when not in operation, thereby maintaining heat dissipation capability without size constraints.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the fan size is increased to improve heat dissipation efficiency, then the heat dissipation capability is improved, but the airflow channel between the fan and housing is narrowed down causing increased resistance
Solution Approach 1:
The fan module is designed to be movable relative to the housing through a connective member, allowing it to dynamically change position between a first position (when not operating) and a second position (when operating). This dynamic adjustment enables the airflow channel size to be optimized for different operational states, resolving the contradiction between fan size and airflow resistance.
2Productivity
If the fan size is increased to improve heat dissipation efficiency, then the heat dissipation capability is improved, but the inner space of the system housing is limited restricting the fan size
Solution Approach 1:
The solution moves the fan module from a fixed two-dimensional plane within the housing to a three-dimensional space by allowing movement along the connection member. This enables the fan to occupy different spatial positions, effectively utilizing the third dimension to resolve the space limitation while maintaining large fan size for improved heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the use of a larger fan module to enhance heat dissipation efficiency by eliminating the need for an airflow channel when not in operation, reducing airflow resistance and maintaining performance.
Implementation Method 1
The fan module is movably connected to the connective member, and is configured to move between a first position and a second position relative to the enclosure based on the connective member
Data Source
AI summary
The disclosure provides a heat dissipation device, including an enclosure, a connective member, and a fan module. The enclosure includes a first cover body and a second cover body that are opposite to each other. The second cover body includes an opening. The connective member is connected to one of the first cover body and the second cover body in the enclosure. The fan module is movably connected to the connective member, and is configured to move between a first position and a second position relative to the enclosure based on the connective member. When moving to the first position, the fan module is located in the enclosure.