Heat Dissipation Device for Orthogonal Electronic Card
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Solution Overview
Problem
Existing heat dissipation devices for electronic boards, particularly those with orthogonal insertion directions, face challenges in achieving reliable mechanical, electric, and thermal coupling, leading to inefficient heat dissipation and installation complexities in high-performance computing systems.
Innovation Solution
A heat dissipation device comprising a support body with a heat dissipation surface and holding elements that allow orthogonal insertion and positioning, utilizing a leveling member and adjustment means for secure thermal coupling with a 'cold plate' style support plate, ensuring effective heat transfer and installation even with limited access directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If orthogonal insertion direction is used for electronic boards, then power density can be maximized, but reliable thermal coupling with cooling plate becomes difficult to achieve
Solution Approach 1:
The patent employs adjustable support elements that can be dynamically positioned to adapt to different electronic board configurations. These support elements include adjustment mechanisms allowing modification of position and orientation, enabling reliable thermal contact regardless of the orthogonal insertion orientation of the electronic board, thus resolving the contradiction between maximizing power density through orthogonal insertion and ensuring reliable thermal coupling.
Solution Approach 2:
The invention utilizes support elements with adjustable geometric parameters including position, orientation, and contact surface area. By changing these parameters, the system can optimize thermal contact between the cooling plate and electronically components on orthogonally inserted boards, maintaining reliable thermal coupling while preserving the high power density benefits of orthogonal insertion architecture.
2Reliability
If complex connection devices are used for orthogonal insertion, then mechanical and electric coupling can be achieved, but device complexity increases
Solution Approach 1:
The patent integrates multiple functions into a unified support structure that simultaneously provides mechanical support, thermal conduction, and positioning for orthogonally inserted electronic boards. The support elements serve multiple purposes including structural reinforcement, heat dissipation pathways, and alignment guidance, thereby achieving reliable mechanical and electric coupling without proportionally increasing device complexity.
Solution Approach 2:
The invention combines thermal management functions with mechanical support functions in an integrated structure. The support elements are designed to perform both structural and thermal roles, merging what would traditionally be separate systems into a single unified component, thus reducing overall device complexity while maintaining coupling reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable and extensive heat dissipation, facilitating efficient installation and maximizing power density in high-performance computing systems by ensuring precise mechanical, electric, and thermal coupling, while allowing for compact and dense system integration.
Implementation Method 1
a heat dissipation surface (14) configured to dissipate the heat transmitted to it by thermal conduction
Data Source
AI summary
Heat dissipation device for an electronic board comprising a support body connected to the electronic board, said electronic board being provided with an electric connection interface which can be inserted into/extracted from an electric connector provided in a direction orthogonal with respect to the lying plane of a support plate, having a heat dissipation surface configured to dissipate the heat transmitted to it by thermal conduction, wherein said heat dissipation device comprises at least one holding element and a leveling member, coordinated with respect to each other in order to position a surface of the support body in contact with the heat dissipation surface of the support plate.