Heat Dissipation Duct for Electronic Device Thermal Management
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Solution Overview
Problem
Conventional electronic devices lack an effective heat dissipation structure, resulting in inefficient heat dissipation within closed enclosures, leading to reduced heat dissipation efficiency.
Innovation Solution
Incorporation of a heat dissipation structure comprising a heat dissipation duct and heat transfer members, including a first and second heat transfer member with Thermal Interfacing Material (TIM), to efficiently transfer heat generated from heating elements, such as printed circuit boards, to the outside through acoustic holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation structure is not provided inside the enclosure, then the structure remains simple and compact, but heat dissipation efficiency deteriorates as heat stays in the closed space
Solution Approach 1:
The heat dissipation duct is nested within the enclosure structure, utilizing the existing housing space. The duct is positioned between the printed circuit board and the housing inner wall, effectively using the available internal volume without requiring additional external space or complex external structures.
Solution Approach 2:
The heat dissipation duct acts as an intermediary component between the heat source (printed circuit board) and the external environment. It provides a dedicated thermal pathway that mediates heat transfer from the enclosed space to the outside, improving heat dissipation without requiring fundamental structural changes.
2Temperature
If heat is allowed to accumulate in the closed enclosure space, then the structure remains sealed and simple, but heat dissipation efficiency deteriorates
Solution Approach 1:
The heat dissipation duct is positioned at a specific location on the housing (the right side in the embodiment) rather than requiring changes to the entire enclosure structure. This localized approach maintains the sealed nature of most of the enclosure while providing a dedicated thermal escape path at a specific point.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient heat dissipation from internal heating elements to the outside, effectively addressing the inefficiencies in conventional designs by utilizing a heat transfer path that includes a heat dissipation duct and heat transfer members to dissipate heat generated from both the printed circuit board and power supply unit.
Implementation Method 1
a heat dissipation structure (28) disposed on the heating element to transfer heat generated from the heating element
Implementation Method 2
a heat dissipation duct (33) disposed at least partially on the heat dissipation structure to transfer the heat transferred from the heat dissipation structure to the outside through the acoustic holes
Data Source
Figure 1
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AI summary
An electronic device according to various embodiments of the disclosure includes: a housing including a plurality of acoustic holes; an enclosure mounted in the housing; at least one heating element disposed in the enclosure; a heat dissipation structure disposed on the heating element to transfer heat generated from the heating element; and a heat dissipation duct disposed at least partially on the heat dissipation structure to provide a path for transferring the heat transferred from the heat dissipation structure to the outside through the acoustic holes. The heat dissipation structure may include: at least one first heat transfer member coupled to the one heating element; and a second heat transfer member disposed at least partially on the first heat transfer member to transfer, to the heat dissipation duct, heat transferred from the first heat transfer member.