Heat Dissipation Assembly with Fan and Sensor for 5G Devices
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Solution Overview
Problem
Existing heat dissipation methods for electronic devices, particularly in 5G-enabled devices, cause excessive interference with internal structures and may not achieve desired heat dissipation effects, leading to local overheating and noise leakage.
Innovation Solution
A heat dissipation assembly comprising a heat dissipation fan and temperature sensor, integrated with a processor cover plate and control mainboard, which utilizes heat dissipation openings to enhance airflow and temperature monitoring for efficient heat removal while minimizing noise interference and structural interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional heat dissipation methods are used, then heat dissipation effect is improved, but interference with internal structures increases
Solution Approach 1:
The heat dissipation assembly is nested within the processor cover plate structure. The fan unit is positioned in the first cavity formed by the processor cover plate and control mainboard, with the fan blade rotating within the second cavity. This nesting approach allows the heat dissipation components to be integrated into the existing device structure without adding external complexity or interfering with other internal components.
2Temperature
If heat dissipation openings are added to processor cover plate, then heat dissipation efficiency is improved, but noise leakage increases
Solution Approach 1:
The processor cover plate is designed with selective local qualities: the first portion includes heat dissipation openings to enable efficient heat removal, while the second portion remains substantially closed to contain noise. This local differentiation allows the same component to simultaneously achieve both heat dissipation efficiency and noise reduction by applying different structural characteristics to different regions of the cover plate.
3Device complexity
If heat dissipation assembly is integrated into accommodation space, then structural interference is reduced, but temperature monitoring complexity increases
Solution Approach 1:
The temperature sensor is electrically connected to the control mainboard, merging the temperature monitoring function with the existing control system. This integration allows the processor cover plate assembly to maintain a simple closed structure while the control mainboard handles temperature detection and fan control, avoiding the need for complex monitoring mechanisms within the heat dissipation assembly itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces processor overheating, minimizes noise leakage, and improves heat dissipation efficiency by using a heat dissipation fan and temperature sensor to control airflow and heat dissipation based on temperature readings, ensuring effective cooling without interfering with other internal components.
Implementation Method 1
a heat dissipation fan and a temperature sensor electrically coupled to the heat dissipation fan
Implementation Method 2
a temperature sensor electrically coupled to the heat dissipation fan
Implementation Method 3
The processor is arranged on the control mainboard and received in an accommodation space defined by the processor cover plate and the control mainboard
Implementation Method 4
The accommodation space is in communication with the internal mounting space through the plurality of heat dissipation openings
Data Source
AI summary
A heat dissipation assembly can be applied to the electronic device. By providing a heat dissipation fan and a temperature sensor for the heat dissipation assembly, and arranging the heat dissipation assembly in an accommodation space defined by a processor cover plate and a control mainboard, the heat dissipation fan can improve a heat dissipation effect on the processor by utilizing air flow generated by the heat dissipation fan in the accommodation space in cooperation with heat dissipation openings in the processor cover plate.