Heat Dissipation Fan Shell Design for Dust Protection
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Solution Overview
Problem
Existing computing devices face inefficiencies due to inadequate heat dissipation, which leads to reduced computing efficiency and contamination of internal components from external dust.
Innovation Solution
A heat dissipation apparatus comprising a shell with heat dissipation fans mounted inside, where the shell protects the fans from external dust and facilitates effective airflow for heat dissipation, thereby improving computing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation fans are mounted outside the computing device for effective heat dissipation, then heat dissipation performance is improved, but external dust enters the device along with the airflow
Solution Approach 1:
The heat dissipation fans are nested within the shell of the computing device rather than mounted externally. The shell includes a first panel with a first hollowed-out structure that corresponds to the fans, allowing the fans to be positioned inside the device while still providing effective heat dissipation. This nesting approach resolves the contradiction by enabling external-facing airflow for heat dissipation while protecting internal components from direct dust exposure.
Solution Approach 2:
The shell acts as an intermediary structure between the heat dissipation fans and the external environment. It includes a first panel with a first hollowed-out structure that corresponds to the fans, allowing the fans to be positioned inside the device while still providing effective heat dissipation. The shell's side walls enclose the fans, creating a controlled airflow path that dissipates heat while filtering out external dust, thus resolving the contradiction between heat dissipation effectiveness and dust protection.
2Object-affected harmful factors
If heat dissipation fans are mounted inside the shell with protection, then dust entry is reduced, but heat dissipation efficiency may be compromised
Solution Approach 1:
The shell's first panel is designed with a first hollowed-out structure at the specific location where heat dissipation is most needed, corresponding to the position of the fans. This localized design allows maximum airflow and heat dissipation efficiency at the fan location while the rest of the shell provides comprehensive dust protection. The side walls are configured to guide airflow efficiently, ensuring that dust protection does not compromise heat dissipation performance.
3Temperature
If multiple heat dissipation fans are arranged in columns and rows, then heat dissipation coverage is improved, but device complexity increases
Solution Approach 1:
The heat dissipation system is segmented into multiple independent fans arranged in columns and rows within the shell. Each fan operates independently to provide localized heat dissipation coverage. The first panel's hollowed-out structure is correspondingly segmented to accommodate each fan's position. This segmentation allows comprehensive heat dissipation coverage across different areas of the device while maintaining modular simplicity in the overall design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively reduces external dust entry into the computing device, maintains the cleanliness of internal components, and enhances computing efficiency by improving heat dissipation performance.
Implementation Method 1
at least one heat dissipation fan mounted in the shell, wherein the shell includes a first panel and side walls disposed along a circumferential direction of the first panel, the at least one heat dissipation fan is disposed on the first panel
Implementation Method 2
a side of the at least one heat dissipation fan away from the first panel is configured to face towards a component to be cooled
Data Source
AI summary
A heat dissipation apparatus and a computing device are provided. The heat dissipation apparatus comprises a shell and at least one heat dissipation fan mounted in the shell; the shell comprises a first panel and side walls arranged in the circumferential direction of the first panel; the at least one heat dissipation fan is arranged on the first panel; the first panel is provided with a first hollow structure corresponding to the at least one heat dissipation fan; the side, away from the first panel, of the at least one heat dissipation fan is configured to face a component to be cooled.