Heat-Dissipation Structure for Foldable Electronic Devices
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Solution Overview
Problem
Laptop computers generate significant heat, leading to reduced battery life and increased noise due to the use of fans for heat dissipation, which is inefficient and uncomfortable.
Innovation Solution
A heat-dissipation structure that includes a first heat-dissipation tube in the host, a rotation joint, and a second heat-dissipation tube in the display, utilizing a cooling liquid that vaporizes to a gas to efficiently dissipate heat without the need for fans, allowing the heat to be transferred through the display for effective cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fans are used to dissipate heat, then heat dissipation efficiency is improved, but battery life deteriorates due to increased power consumption
Solution Approach 1:
The patent extracts the fan component from the heat dissipation system and replaces it with a passive heat dissipation structure consisting of heat dissipation holes and heat conduction components. This eliminates the power consumption associated with active fan operation while maintaining effective heat dissipation through natural convection and conduction pathways.
Solution Approach 2:
The heat dissipation structure operates autonomously without external power input. The design utilizes natural air convection currents generated by temperature differences to drive heat dissipation through the heat dissipation holes, and relies on thermal conduction through the heat conduction component to transfer heat from the heat source, making the system self-sufficient and energy-efficient.
2Productivity
If fans are used to dissipate heat, then heat dissipation efficiency is improved, but noise level deteriorates
Solution Approach 1:
The patent removes the fan component from the system, thereby eliminating the primary source of noise associated with mechanical rotation and blade operation. The passive heat dissipation structure replaces active mechanical ventilation with static heat conduction and natural convection pathways that generate minimal noise.
Solution Approach 2:
The patent replaces the mechanical fan-driven ventilation system with a thermal conduction and natural convection-based heat dissipation system. This substitution eliminates mechanical moving parts that generate noise, using instead thermal gradients and fluid dynamics to achieve heat removal in a quieter manner.
3Productivity
If the number of heat-dissipation elements is increased, then heat dissipation efficiency is improved, but device complexity deteriorates
Solution Approach 1:
The patent combines multiple heat dissipation functions into an integrated structure where the heat conduction component and heat dissipation holes work together as a unified system. The heat conduction component serves both as a thermal pathway and as a structural element that incorporates heat dissipation holes, eliminating the need for separate, complex heat dissipation components.
Solution Approach 2:
The heat conduction component is designed to perform multiple functions simultaneously: it conducts heat from the heat source, provides structural support, and incorporates heat dissipation holes for convective cooling. This multi-functionality reduces the overall number of components needed and simplifies the device structure while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases battery life by reducing the need for fan-powered cooling and decreases noise generated by fans, enhancing heat-dissipation efficiency while maintaining device usability and comfort.
Implementation Method 1
a portion of the cooling liquid is changed to a cooling gas
Implementation Method 2
the cooling liquid is changed to a cooling gas
Implementation Method 3
the cooling gas located at the top portion of the second heat-dissipation element condenses to the cooling liquid
Data Source
AI summary
An electronic device with a heat-dissipation structure includes a host, a first heat-dissipation tube, a display, a rotation joint, and a second heat-dissipation tube. The first heat-dissipation tube is disposed in the host. The display is pivoted on the host. The display is rotated relative to the host about a rotation axis. The rotation joint is connected to the first heat-dissipation tube. The second heat-dissipation tube is disposed in the display, and connected to the rotation joint. A cooling liquid is filled in the first heat-dissipation tube.