Heat Dissipation Apparatus With Guide Fins For Airflow Control

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Solution Overview

Problem

Existing heat dissipation apparatuses for suspended electronic devices, such as projectors and indoor surveillance cameras, have limited heat dissipation effectiveness due to restricted fin height and airflow path design, which restricts the heat dissipation performance.

Innovation Solution

A heat dissipation apparatus featuring a base plate with guide fins and heat dissipation fins, where multiple heat dissipation fin groups are arranged with varying gaps from the base plate to enhance airflow flow rate and heat exchange, including the use of stopper fins and heat dissipation teeth to control airflow and improve heat dissipation efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the heat dissipation apparatus is disposed near the ceiling, then the installation space is saved, but the fin height is limited and heat dissipation effect is reduced

Engineering Contradiction:
Improveinstallation spaceVSAvoidheat dissipation effect
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent transforms the traditional vertical fin structure into a horizontal guide fin structure that extends along the base plate surface. This dimensional change allows the heat dissipation apparatus to maintain effective heat exchange area without requiring vertical height, thus solving the contradiction between limited installation space near ceiling and reduced heat dissipation effect.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The guide fins are disposed at intervals to form localized flow paths between adjacent fins. This local quality variation creates optimized airflow channels in different regions, allowing efficient heat dissipation within the constrained horizontal space without uniform structure throughout.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If uniform gap is maintained between base plate and heat dissipation fins, then manufacturing is simplified, but heat exchange efficiency is reduced in high temperature regions

Engineering Contradiction:
Improvegap uniformityVSAvoidheat exchange efficiency
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent implements variable gap distances between the base plate and heat dissipation fins based on local temperature requirements. Regions with higher temperatures have larger gaps to enhance heat exchange efficiency, while other regions maintain smaller gaps. This local quality differentiation optimizes heat dissipation performance without excessive manufacturing complexity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus achieves improved heat dissipation by optimizing airflow flow rates and heat exchange across the base plate, particularly in regions with high temperatures, thereby enhancing the overall heat dissipation performance.

Implementation Method 1

a flow path for flowing of an airflow is formed between two adjacent guide fins

Methodology Applied
Scientific EffectAirflow: Convection

Implementation Method 2

the heat dissipation fin is fixedly connected to the top of the guide fins to dissipate heat of the guide fins

Methodology Applied
Scientific EffectHeat dissipation: Convection

Implementation Method 3

the heat dissipation fin is fixedly connected to the top of the guide fins to dissipate heat of the guide fins

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3700314B1Heat dissipation apparatus
Publication Date: 2021.05.26 HUAWEI TECH CO LTD
  • EP3700314B1 patent drawingFigure 1~2
  • EP3700314B1 patent drawingFigure 3~4
  • EP3700314B1 patent drawingFigure 5~6

AI summary

The present invention provides a heat dissipation apparatus (20), including a base plate (21), a guide fin group (25), and a heat dissipation fin group (29), where the guide fin group (25) is formed on a surface of the base plate (21), the guide fin group (25) is disposed with at least two guide fins (251) that are disposed at an interval, and the guide fins (251) extend along the surface of the base plate (21) from an edge of the base plate (21), and a flow path for flowing of an airflow is formed between two adjacent guide fins (251); and the heat dissipation fin group (29) includes at least one heat dissipation fin (29a, 29b, 29c), where the heat dissipation fin (29a, 29b, 29c) is fixedly connected to the top of the guide fins (251) to dissipate heat of the guide fins (251). According to the heat dissipation apparatus of the present invention, guide fins (451) and a stopper fin (43) are disposed, so as to control an airflow direction when air flows, and further to prevent air with a relatively high temperature from accumulating in a central position of a base plate (21). In addition, a heat dissipation tooth is disposed, to improve an overall heat dissipation effect of the heat dissipation apparatus.