Heat Dissipation Layer With Through Holes For Optical Sensor
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Solution Overview
Problem
In existing display technologies, the optical sensor is in direct contact with the display panel, leading to indentation formation during touch operations, which affects the panel's performance.
Innovation Solution
A heat dissipation layer with an array of through holes is placed between the display panel and the optical sensor, allowing light to pass through and reach the optical identification device without direct contact, thereby preventing indentation and facilitating heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the optical sensor is disposed in direct contact with the display panel, then the structure is simple and easy to manufacture, but indentation is formed on the display panel surface during touch operations, affecting panel performance
Solution Approach 1:
A heat dissipation layer is introduced as an intermediary component between the display panel and the optical sensor. This heat dissipation layer includes an array of through holes that allow light to pass through to the optical sensor while preventing direct contact between the sensor and panel, thereby eliminating indentation formation during touch operations while maintaining manufacturing simplicity
Solution Approach 2:
The heat dissipation layer serves multiple functions simultaneously: it acts as a physical barrier to prevent indentation, provides heat dissipation for the optical sensor through its through holes, and maintains light transmission for fingerprint recognition. This multi-functionality resolves the contradiction by adding a component that addresses multiple issues at once
2Device complexity
If the optical sensor is disposed in direct contact with the display panel, then the device structure is compact, but heat generated by the panel and sensor accumulates, affecting stable operation
Solution Approach 1:
The heat dissipation layer is designed with an array of through holes, creating a porous structure that allows heat to dissipate from the optical sensor while still maintaining the structural integrity needed to prevent indentation. The porous design enables thermal management without significantly increasing device complexity
Solution Approach 2:
The heat dissipation layer acts as a thermal management intermediary between the display panel and optical sensor, providing a pathway for heat dissipation through its through holes while preventing direct thermal coupling that would lead to heat accumulation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents indentation on the display panel surface, ensuring stable operation by allowing light to pass through the through holes and dissipating heat generated by the panel and sensor, enabling effective fingerprint recognition and maintaining panel performance.
Implementation Method 1
a heat dissipation layer disposed between the display panel and the optical sensor
Implementation Method 2
the heat dissipation layer is provided with an array of through holes, through which light passes and reaches an optical identification device in the optical sensor
Data Source
AI summary
The disclosure provides a display module, a manufacturing method, and a display device. The display module includes a display panel, an optical sensor disposed on an opposite side of a light emitting side of the display panel, and a heat dissipation layer disposed between the display panel and the optical sensor, wherein the heat dissipation layer is provided with an array of through holes, through which light passes and reaches an optical identification device in the optical sensor.