Heat Dissipation Device with Localized Thermal Paste
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Solution Overview
Problem
Conventional driving control equipment for electric vehicles faces inefficiencies in heat dissipation due to the uniform application of thermal paste across circuit boards, leading to increased costs and reduced effectiveness in concentrating and guiding heat away from non-heat-source areas.
Innovation Solution
A heat dissipation device with a base, heat dissipation group, and cover that includes a circuit board with a heat source area and non-heat-source area, where thermal paste is applied only to the heat source area, and a cooling blade is positioned to guide heat conduction, reducing unnecessary thermal paste application and enhancing heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal paste is attached to the entire lower surface of the circuit board, then heat conduction coverage is maximized, but manufacturing cost and assembly time increase, and heat dissipation efficiency decreases due to lack of concentration
Solution Approach 1:
The patent applies thermal paste only to the heat source area of the circuit board rather than the entire lower surface. This local quality approach concentrates the thermal paste where heat generation occurs, improving heat dissipation efficiency while reducing material usage and assembly complexity.
Solution Approach 2:
The patent segments the circuit board surface into heat source areas and non-heat source areas. By identifying and treating only the heat source areas with thermal paste, the system achieves targeted heat conduction without the unnecessary application of thermal paste to the entire surface.
2Reliability
If thermal paste is attached to the entire lower surface of the circuit board, then heat conduction coverage is maximized, but heat dissipation efficiency decreases due to lack of concentration and guidance
Solution Approach 1:
The patent implements local quality by applying thermal paste only to the heat source area, creating a focused heat conduction path. This eliminates the complexity of managing thermal paste across the entire board surface and simplifies the heat conduction configuration.
Solution Approach 2:
The patent introduces a heat dissipation structure as an intermediary component that works with the thermal paste to guide and concentrate heat flow. This intermediary system enhances heat dissipation efficiency by providing a dedicated thermal management pathway.
3Reliability
If thermal paste is attached to the entire lower surface of the circuit board, then heat conduction coverage is maximized, but the cost of thermal paste consumption increases
Solution Approach 1:
The patent applies thermal paste only to the heat source area of the circuit board rather than the entire lower surface. This local quality approach concentrates the thermal paste where heat generation occurs, improving heat dissipation effectiveness while significantly reducing material consumption.
Solution Approach 2:
The patent uses partial action by applying thermal paste only to the necessary heat source areas rather than the entire surface. This partial application is sufficient for effective heat dissipation while avoiding the excessive consumption of thermal paste that would occur with full-surface application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively concentrates and guides heat away from heat source areas, improving the overall heat dissipation efficiency while reducing manufacturing and assembly costs by minimizing the use of thermal paste on non-heat-source areas.
Implementation Method 1
a thermal paste 22 is attached to a first surface 241 of the heat source area 24... the heat generated inside the conventional driving control equipment is conducted and then discharged to the outside
Implementation Method 2
the air-cooled type uses a fan with heat dissipation fins to dissipate heat... the heat dissipation group 20 has a circuit board 21 and a cooling blade 23
Data Source
AI summary
A heat dissipation device of electronic equipment has a base, a heat dissipation group, and a cover. The base has an opening, a chamber, and a boss formed in the chamber. The heat dissipation group is connected to the base and has a circuit board and a cooling blade. The circuit board is mounted in the chamber, abuts against the boss, and has a heat source area and at least one non-heat-source area. The heat source area has a first surface facing the boss and a second surface facing the opening. The cooling blade is connected to the base and is located at the second surface. The first surface and the second surface of the heat source area respectively correspond to the boss and the cooling blade in location to provide a guiding direction for heat conduction. The cover is connected to the base.