Heat Dissipation Member with Non-Uniform Capillary Structure
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Solution Overview
Problem
The reduction in product thickness due to design trends in industrial products compresses the internal space of heat dissipation assemblies, leading to a decrease in heat dissipation performance, which affects the overall performance of electronic products.
Innovation Solution
A heat dissipation member with a condensation area and an evaporation area, where the capillary force of the capillary structure layer in the evaporation area is greater than in the condensation area, allowing for faster backflow of the condensate liquid and improved heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the thickness of the heat dissipation member is reduced to meet product thinning requirements, then the portability and aesthetics of the electronic product are improved, but the heat dissipation performance deteriorates
Solution Approach 1:
The capillary structure layer is designed with non-uniform thickness: thicker in the evaporation area to generate stronger capillary force for rapid liquid backflow, and thinner in the condensation area to reduce overall thickness. This local differentiation allows the heat dissipation member to maintain high heat dissipation performance while meeting thinning requirements.
Solution Approach 2:
The patent changes the thickness parameter of the capillary structure layer from uniform to non-uniform distribution. By adjusting the thickness parameter locally (thicker at evaporation end, thinner at condensation end), the system achieves both reduced overall thickness and maintained/improved heat dissipation performance through optimized capillary force distribution.
2Length of stationary object
If the thickness of the capillary structure layer is uniformly reduced, then the overall device thickness is decreased, but the capillary force and liquid backflow speed deteriorate
Solution Approach 1:
The capillary structure layer thickness is locally optimized: the evaporation area maintains greater thickness to ensure strong capillary force and fast liquid backflow, while the condensation area uses reduced thickness. This resolves the contradiction by concentrating the necessary thickness where capillary force is needed most.
Solution Approach 2:
The capillary structure layer is segmented into different thickness zones corresponding to different functional areas (evaporation area vs. condensation area). This segmentation allows each zone to have optimized thickness for its specific function, with the evaporation zone providing strong capillary action and the condensation zone contributing minimal thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced capillary force in the evaporation area accelerates the circulation of the heat dissipation medium, thereby improving heat dissipation efficiency and overall performance of electronic apparatuses.
Implementation Method 1
A capillary force of the capillary structure layer in the evaporation area is greater than a capillary force of the capillary structure layer in the condensation area
Implementation Method 2
The evaporation area is arranged close to the heating element in the application state
Implementation Method 3
heat dissipation member including a condensation area, an evaporation area, and a capillary structure layer
Implementation Method 4
The condensation area is arranged away from a heating element of an electronic apparatus in an application state
Implementation Method 5
heat dissipation member including a condensation area, an evaporation area, and a capillary structure layer
Data Source
AI summary
A heat dissipation member includes a condensation area, an evaporation area, and a capillary structure layer. The condensation area is arranged away from a heating element of an electronic apparatus in an application state. The evaporation area is arranged close to the heating element in the application state. A capillary force of the capillary structure layer in the evaporation area is greater than a capillary force of the capillary structure layer in the condensation area.