Heat Dissipation Member for Semiconductor Package Thermal Management
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Solution Overview
Problem
Conventional semiconductor packages face inefficiencies in heat dissipation due to encapsulants with poor thermal conductivity, leading to heat accumulation and potential chip damage during molding processes, which complicates fabrication and increases costs.
Innovation Solution
A heat dissipation package structure and method involving a heat dissipation member with a heat dissipation section and supporting section, where the semiconductor chip is mounted on a chip carrier, and the encapsulant is thinned to expose the inactive surface and top surface of the heat dissipation section, allowing direct heat dissipation without encapsulant interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the semiconductor chip surface is directly exposed from the encapsulant to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but the chip may be damaged by pressing forces during molding and post-deflashing processes are required
Solution Approach 1:
A heat dissipation member is introduced as an intermediary component between the semiconductor chip and the encapsulant. This member has a heat dissipation section that contacts the chip's inactive surface and a supporting section that extends into the encapsulant. The intermediary structure allows heat to be conducted from the chip through the heat dissipation member to the encapsulant, while the supporting section provides mechanical support to prevent chip damage during molding, eliminating the need for direct chip exposure and post-deflashing processes.
2Object-affected harmful factors
If the encapsulant completely encapsulates the heat dissipation member, then the chip is protected from contamination, but heat dissipation efficiency is limited due to the encapsulant's poor thermal conductivity
Solution Approach 1:
The heat dissipation member is designed with differentiated local properties: the heat dissipation section has high thermal conductivity to efficiently conduct heat from the chip, while the supporting section provides mechanical support. This local quality differentiation allows the encapsulant to completely encapsulate and protect the chip while the heat dissipation member's high conductivity path bypasses the encapsulant's poor thermal conductivity, maintaining both protection and efficient heat dissipation.
3Manufacturing precision
If a tape is pre-adhered to the mold cavity wall to prevent flashing, then flashing is prevented, but the process becomes more complex and time-consuming
Solution Approach 1:
The heat dissipation member is pre-mounted on the chip carrier before the encapsulation molding process. The supporting section of the heat dissipation member extends downward to provide mechanical support and positioning, which preliminarily establishes the correct chip position and prevents flashing during molding without requiring additional tapes or complex mold modifications. This preliminary action simplifies the overall fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances heat dissipation efficiency, prevents chip damage from pressing forces, and simplifies the fabrication process while reducing costs by allowing direct heat dissipation and avoiding post-processing steps like deflashing.
Implementation Method 1
heat generated during operation of the semiconductor chips cannot be efficiently dissipated to the outside via the encapsulant... heat dissipation member... efficient heat dissipation path
Data Source
AI summary
A heat dissipation package structure and method for fabricating the same are disclosed, which includes mounting and electrically connecting a semiconductor chip to a chip carrier through its active surface; mounting a heat dissipation member having a heat dissipation section and a supporting section on the chip carrier such that the semiconductor chip can be received in the space formed by the heat dissipation section and the supporting section, wherein the heat dissipation section has an opening formed corresponding to the semiconductor chip; forming an encapsulant to encapsulate the semiconductor chip, and the heat dissipation member; and thinning the encapsulant to remove the encapsulant formed on the semiconductor chip to expose inactive surface of the semiconductor chip and the top surface of the heat dissipation section from the encapsulant. Therefore, the heat dissipation package structure is fabricated through simplified fabrication steps at low cost, and also the problem that the chip is easily damaged in a package molding process of the prior art is overcome.