Heat Dissipation Module With Fingerprint Sensor Slots
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Solution Overview
Problem
The existing design of OLED display devices with integrated fingerprint modules increases the thickness and assembly complexity due to the placement of fingerprint sensors and flexible printed circuits on the heat dissipation module, which occupies valuable space.
Innovation Solution
A heat dissipation module with strategically designed accommodating slots for fingerprint sensors and flexible printed circuits, combined with a light shielding buffer layer, allows for efficient placement and reduced thickness, enabling easier assembly and effective fingerprint identification.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If fingerprint module is arranged on the back of heat dissipation module, then fingerprint identification function is achieved, but thickness of complete machine increases
Solution Approach 1:
The fingerprint module is nested within the heat dissipation module by forming accommodating slots in the heat dissipation base material layer. The fingerprint sensor and flexible printed circuit are housed inside these slots, allowing the fingerprint module to be integrated within the existing heat dissipation structure rather than adding external thickness.
Solution Approach 2:
Instead of placing the fingerprint module on the external back surface of the heat dissipation module (adding thickness in the Z-direction), the solution moves the components into the thickness dimension of the heat dissipation base material layer itself, utilizing the internal space along the Z-axis to accommodate the fingerprint components.
2Adaptability or versatility
If fingerprint module is arranged on the back of heat dissipation module, then fingerprint identification function is achieved, but assembly difficulty increases
Solution Approach 1:
The heat dissipation base material layer is segmented by forming distinct accommodating slots - a first slot for the fingerprint sensor and a second slot for the flexible printed circuit. This segmentation pre-positions the components during manufacturing, reducing assembly complexity by eliminating the need for separate alignment and mounting operations.
Solution Approach 2:
The accommodating slots are pre-formed in the heat dissipation base material layer during its manufacturing process. This preliminary action of creating the slots beforehand allows the fingerprint sensor and flexible printed circuit to be easily installed during assembly, reducing the overall assembly difficulty.
3Adaptability or versatility
If fingerprint module occupies space of complete machine, then fingerprint identification function is achieved, but available space is reduced
Solution Approach 1:
The fingerprint module components are nested within the internal volume of the heat dissipation base material layer. The accommodating slots utilize the existing thickness of the heat dissipation layer, allowing the fingerprint sensor and flexible printed circuit to occupy space that would otherwise be unused internal volume, rather than encroaching on the available space of the complete machine.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces the overall thickness of the display device and simplifies the assembly process by accommodating fingerprint modules within the heat dissipation module, while maintaining effective heat dissipation and fingerprint identification functionality.
Implementation Method 1
a light shielding buffer layer, located on a side of the heat dissipation base material layer facing away from an opening of the second accommodating slot and provided with a hollowed-out area
Implementation Method 2
a heat dissipation base material layer, provided with a first accommodating slot for accommodating a fingerprint sensor and a second accommodating slot for accommodating a flexible printed circuit
Data Source
AI summary
A heat dissipation module includes: a heat dissipation base material layer, provided with a first accommodating slot for accommodating a fingerprint sensor and a second accommodating slot for accommodating a flexible printed circuit, the fingerprint sensor being electrically connected to the flexible printed circuit, the first accommodating slot penetrating through the heat dissipation base material layer; and a light shielding buffer layer, on a side of the heat dissipation base material layer away from an opening of the second accommodating slot and provided with a hollowed-out area, an orthographic projection of the hollowed-out area on the heat dissipation base material layer being in the first accommodating slot, the hollowed-out area being configured to expose a photosensitive area of the fingerprint sensor, and the impedance of a surface of a side of the light shielding buffer layer away from the heat dissipation base material layer being 106Ω-1010Ω.