Heat Dissipation Module With Perpendicular Airflow Slot
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Solution Overview
Problem
Existing heat dissipation modules for electronic devices are inefficient in dissipating heat from both internal heating elements and casings, leading to potential overheating and malfunction.
Innovation Solution
A heat dissipation module incorporating a heat dissipation structure with a heat dissipation fan and air flow guiding portion, featuring a slot that directs airflow perpendicular to the fan's outflow direction, enhancing heat dissipation efficiency by channeling airflow between the heat dissipation portion and the casing, and allowing detachable assembly for maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional heat dissipation modules are used, then the structure is simple, but the heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation module is divided into multiple functional components: a heat dissipation fan for generating airflow, a heat dissipation structure with heat dissipation portions, and air flow guiding portions with slots. This segmentation allows each component to perform its specific function optimally, improving overall heat dissipation efficiency while maintaining manageable structural complexity through modular design.
Solution Approach 2:
The air flow guiding portion introduces a new dimensional aspect to airflow management by using slots that direct airflow along a direction not parallel to the fan's outflow direction. This creates a multi-dimensional airflow pattern that enhances heat dissipation efficiency by improving air circulation between the heat dissipation portions and the casing, beyond the simple radial airflow of traditional fans.
2Productivity
If heat dissipation airflow is increased, then heat dissipation efficiency improves, but airflow distribution uniformity deteriorates
Solution Approach 1:
The air flow guiding portion acts as an intermediary between the heat dissipation fan and the heat dissipation portions. It receives the fan's outflow and redistributes it through slots to create a more uniform airflow distribution across the heat dissipation portions, preventing concentrated airflow patterns that would reduce heat dissipation efficiency.
Solution Approach 2:
The slots in the air flow guiding portion are strategically positioned and oriented to deliver airflow to specific local areas of the heat dissipation portions. This localized airflow distribution ensures that each heat dissipation portion receives appropriate airflow based on its specific thermal load, improving overall heat dissipation efficiency while maintaining uniform airflow distribution.
3Ease of manufacture
If the heat dissipation fan is fixed in the structure, then assembly is simple, but maintenance and replacement become difficult
Solution Approach 1:
The heat dissipation fan is designed with dynamic assembly characteristics, allowing it to be detachably mounted to the heat dissipation structure. This enables the fan to be easily removed and reinstalled, facilitating maintenance and replacement operations while maintaining a stable assembled configuration during normal operation, thus balancing assembly simplicity with ease of repair.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation efficiency for both internal heating elements and casings, effectively lowering temperatures and facilitating easy replacement and maintenance of the heat dissipation fan.
Implementation Method 1
the heat dissipation fan is adapted to provide a heat dissipation air flow
Implementation Method 2
the air flow guiding portion is adapted to guide a part of the heat dissipation air flow to pass through the slot along a direction not parallel to an outflow direction of the heat dissipation fan
Implementation Method 3
a heat dissipation flow channel is formed between the heat dissipation portion and the casing
Implementation Method 4
heat dissipation flow channel is formed between the heat dissipation portion and the casing
Data Source
AI summary
A heat dissipation module adapted for an electronic device is provided. The heat dissipation module includes a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is disposed in a casing of the electronic device and has a heat dissipation portion, wherein a heat dissipation flow channel is formed between the heat dissipation portion and the casing. The heat dissipation fan is adjacent to the heat dissipation portion, wherein the heat dissipation fan or the heat dissipation structure has an air flow guiding portion with a slot connected to the heat dissipation flow channel, the heat dissipation fan provides a heat dissipation air flow, and the air flow guiding portion guides a part of the heat dissipation air flow to pass through the slot along a direction not parallel to an outflow direction of the heat dissipation fan and then pass through the heat dissipation flow channel.